All items tagged with product development (919)
Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices
October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.
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DirectOut Celebrates 10 Years of Ravenna AoIP Partnership
October 26, 2021 by audioXpress Staff

DirectOut Celebrates 10 Years of Ravenna AoIP Partnership

DirectOut is celebrating a decade as a trusted Ravenna partner, helping to promote real-time distribution of audio through IP-based network environments. To celebrate the company’s efforts and achievements with the technology, DirectOut launched a limited edition of their latest EXBOX.RAV AoIP-to-MADI converter in Ravenna green. Only 50 units of the anniversary edition will be made.
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Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification
October 22, 2021 by audioXpress Staff

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification

Renesas Electronics announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced in 2020. Renesas expects to have first samples of the new MCUs in the first quarter of 2022.
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Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27
October 21, 2021 by Audio Engineering_Society

Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27

The AES Audio Product Education Institute (APEI) continues to explore the practice and benefits of simulation-driven audio architecture design. In the second Modeling and Measurement webinar in this series (October 27, 12pm EDT), experts from COMSOL, JJR Acoustic and Facebook, will describe and detail a real virtual architectural design story. Registration for this webinar is now available.
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R&D Stories: Getting Started with Automotive Audio Bus (Part 4)
October 20, 2021 by Brewster LaMacchia

R&D Stories: Getting Started with Automotive Audio Bus (Part 4)

In this article, Brewster LaMacchia concludes his series on Automotive Audio Bus (A2B) applications (not just for automotive). After an introduction to the properties of this locally networked audio transport, a look at A2B system design, and A2B data transport and interface, in Part 4, the author looks at systems and tools that are available to speed prototyping and evaluation. This article was originally published in audioXpress, January 2021.
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Avnu Alliance Launches Streamlined Milan Advanced Certification Program
October 20, 2021 by audioXpress Staff

Avnu Alliance Launches Streamlined Milan Advanced Certification Program

The Avnu Alliance industry consortium promoting deterministic networking based on IEEE 802.1 AVB/TSN standards, introduced a new Milan Advanced Certification Program for faster, and less expensive testing and certification of professional audio and video end devices for its members. This initiative is intended to encourage further adoption of the Milan network protocol by more manufacturers.
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Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform
October 18, 2021 by audioXpress Staff

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

Synaptics announced its newest AudioSmart AS33970 headset platform SoC, directly targeting the fastest growing product categories, from work-from-anywhere TWS earbuds to hearables. As the San Jose, California-based company details, the new SoC offers the world’s first highly integrated AI-enabled ENC (Environmental Noise Cancellation) and hybrid ANC (Active Noise Cancellation) single-chip solution integrating neural and voice processing engines for optimal audio performance.
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Diodes Introduces High-Efficiency Class-D Stereo Audio Amplifier Device
October 13, 2021 by audioXpress Staff

Diodes Introduces High-Efficiency Class-D Stereo Audio Amplifier Device

Diodes Incorporated introduced the PAM8965 Class-D stereo audio power amplifier with an integrated synchronous boost converter, and external audio feedback pins, which allow for customization of sound. This high-efficiency device is targeted for use in AI-enabled, portable, wireless speaker systems, and portable musical instruments - where elevated output power, extended battery life, and compact construction are all key requirements.
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Sensory Releases Speech Recognition Models for Children
October 6, 2021 by audioXpress Staff

Sensory Releases Speech Recognition Models for Children

Sensory, the recognized voice recognition and edge-AI voice solutions specialist announced availability of new custom trained speech recognition models that understand the unique linguistic patterns associated with children’s speech. This new children’s speech recognizer unlocks a higher level of accuracy and privacy for apps, toys, kid’s wearables, and education technologies, all key market segments for voice interface applications that Sensory is targeting.
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Packetcraft Announces Bluetooth 5.3 Qualification and LC3 Codec for LE Audio
October 5, 2021 by audioXpress Staff

Packetcraft Announces Bluetooth 5.3 Qualification and LC3 Codec for LE Audio

Wireless software licensor Packetcraft, Inc. announced its Packetcraft Controller software has achieved Bluetooth 5.3 qualification, including the world’s first qualification of new Bluetooth 5.3 link layer technical features. Packetcraft also announced the availability of Packetcraft LC3, a highly optimized and efficient LC3 codec for Bluetooth LE Audio.
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