DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

There’s a lot happening in the true wireless stereo (TWS) category and this market update article intends to provide a quick overview of the state-of the-art technologies and platforms in the space, as well as some reference approaches in product design. This audioXpress Market Update addresses what is happening in this vibrant product category in 2021.

CEVA and VisiSonics are promoting a joint webinar to promote 3D audio technology and emerging applications for immersive listening experiences. 3D Audio for Everyone is the motivation behind this session, targeted directly at audio system engineers, product managers and developers looking to add 3D Audio capabilities to Hearables, Smart Home, Mobile, and Automotive products. Getting spatial audio to work across all platforms is the next exciting frontier in audio. November 23, 2020 at 08:00 AM PST / 11:00 AM EST.

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).