All items tagged with product development (903)
NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications
October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.
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TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors
October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.
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Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound
September 26, 2019 by audioXpress Staff

Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound

Sound processing pioneer Dirac announced a commercial agreement with RHA to explore the integration of Dirac’s latest audio algorithms into the British manufacturer's headphones. According to the Swedish company, "the collaboration with RHA marks an important step for Dirac as it establishes itself as a global leader in digital sound optimization solutions for the headphone market – as it has for the luxury automotive, home theater, and mobile markets." RHA says this relationship with Dirac reinforces the company’s mission to deliver the best possible audio quality.
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Orchard Audio Launches Kickstarter Campaign for BOSC Monoblock GaN Audio Amplifier
September 24, 2019 by audioXpress Staff

Orchard Audio Launches Kickstarter Campaign for BOSC Monoblock GaN Audio Amplifier

There is a very interesting new audio project being promoted on Kickstarter. Coming from Orchard Audio, the BOSC is a well engineered hi-fi monoblock audio amplifier that explores the latest gallium nitride (GaN) semiconductor technology to achieve ultra-high performance in a small package. This compact and affordable 150 watt amplifier shows a lot of potential, with an impressive circuit design and high-quality sound, and is available in 3-4Ω (13.8dB gain) or 6-8Ω (16.8dB gain) versions.
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DSP Concepts TalkTo Audio Voice Capture Technology Enables New Exciting Products at IFA 2019
September 11, 2019 by audioXpress Staff

DSP Concepts TalkTo Audio Voice Capture Technology Enables New Exciting Products at IFA 2019

Audio processing embedded software provider DSP Concepts announced that it has delivered the industry’s most advanced voice user interface and audio playback technology, resulting in Braun Audio shipping the industry’s first multichannel product with hands-free, far-field voice control for Google Assistant. As anticipated, Braun’s return to the premium audio market was recently confirmed at IFA 2019, resulting from a collaboration with DSP Concepts, Pure, StreamUnlimited, and Karl-Heinz Fink.
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Libre Wireless Technologies Powers New Generation of Connected Speakers
September 10, 2019 by audioXpress Staff

Libre Wireless Technologies Powers New Generation of Connected Speakers

Libre Wireless Technologies announced that its MAVID low power mic-to-cloud platform is powering the new Hansong miniature portable speaker Microdot XS, a full featured Wi-Fi/Bluetooth audio speaker with far field voice interface featuring Amazon Alexa Built-In. Libre Wireless also announced a broad relationship with German brand Canton across an extensive range of Smart Wireless music streaming multiroom speakers, amps and soundbars, all using Libre’s advanced LibreSync WiFi connectivity modules.
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Microchip Simplifies Power Delivery (PD) in Growing USB Type-C Charging Market
September 2, 2019 by audioXpress Staff

Microchip Simplifies Power Delivery (PD) in Growing USB Type-C Charging Market

USB Type-C has become increasingly popular, and with the introduction of Power Delivery (PD), it is now possible to charge more types of devices – and charge faster – than ever before. To remove the traditional complexity and high costs associated with implementing USB Type-C, Microchip Technology announced two new USB 3.1 solutions that simplify USB Type-C PD for a range of applications.
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AES 2019 International Conference on Headphone Technology: It Should Happen Every Year!
August 29, 2019 by Nora Wong

AES 2019 International Conference on Headphone Technology: It Should Happen Every Year!

Like the previous conference that was held in 2016 in Aalborg, Denmark, the Audio Engineering Society (AES) Headphone Technology Conference in San Francisco, was a very successful and insightful event for all the participants. The Presidio park venue was also idyllic with the usual crisp waterfront weather. Perhaps too successful, as the event was sold out before it opened.
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Prism Sound Test & Measurement Changes its Trading Name to Spectral Measurement
August 27, 2019 by audioXpress Staff

Prism Sound Test & Measurement Changes its Trading Name to Spectral Measurement

Prism Sound’s Test & Measurement division has re-launched itself specializing exclusively in audio test & measurement solutions and trading under the new name of Spectral Measurement. Prism Media Products Limited, the company behind the innovative dScope Series III Audio Analyzer, will now focus exclusively on developing new audio test & measurement solutions.
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AES New York 2019 Product Development Track: The New Era of Product Development
August 12, 2019 by Audio Engineering_Society

AES New York 2019 Product Development Track: The New Era of Product Development

As audio product development surges forward at a breakneck pace, the 147th Audio Engineering Society International Convention is the premier destination for audio product developers to enhance their trade. Each year the Product Development Track presents four days of themed Workshops during the AES Convention. Building on last year’s theme “Make Audio Matter,” the 2019 Product Development Track is built on the theme “The New Era of Product Development.”
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