All items tagged with MWC 2017 (11)

Elliptic Labs Introduces Inner Peace Ultrasonic Presence Detection Technology

March 6, 2017 by audioXpress Staff

Elliptic Labs Introduces Inner Peace Ultrasonic Presence Detection Technology

Elliptic Labs, a company specializing in ultrasound sensing, announced Inner Peace, a new technology that takes presence detection to new levels and is aimed at the fast-multiplying market for intelligent personal assistants and similar consumer/household devices. The new technology was demonstrated at the 2017 Mobile World Congress, in Barcelona, and is more reliable, and covers broader area than alternative approaches.

Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

March 2, 2017 by audioXpress Staff

Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

At Mobile World Congress 2017, Barcelona, Infineon Technologies and XMOS partner to deliver a new building block for voice recognition. It features a combination of Infineon’s BGT60TR24B 60GHz 2Tx/4Rx radar IC with accompanying antenna, 70dB SNR silicon microphone sensors, based on Infineon’s dual backplate MEMS technology, and an audio processor from XMOS. In combination, the solution provides far field voice capture by audio beamforming combined with radar target presence detection.

New Rayz Lightning Earphones from Pioneer with Truly Smart Features

March 2, 2017 by audioXpress Staff

New Rayz Lightning Earphones from Pioneer with Truly Smart Features

During Mobile World Congress 2017, in Barcelona, Pioneer Home Entertainment U.S.A introduced the innovative Rayz and Rayz Plus earphones. Rayz and Rayz Plus blend the intelligence of an iOS app with Lightning connectivity to deliver completely new experiences not possible through the 3.5mm headphone jack. Plus, they are well designed products that will easily please the more demanding users, featuring a very light construction and active noise cancelation to start with.

STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devices

February 28, 2017 by audioXpress Staff

STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devices

Top MEMS supplier STMicroelectronics, DSP Group, and Sensory, a leading technology provider of voice interface and keyword-detect algorithms, have revealed details for a highly power-efficient, voice-detecting and -processing microphone that delivers keyword-recognition capabilities in a compact package. Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.

Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset

February 28, 2017 by audioXpress Staff

Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset

At Mobile World Congress 2017, Waves Audio and Realtek unveiled their co-developed WNX7000, the world's first integrated circuit (IC) with Waves Nx virtual reality audio technology embedded. The DSP specialists from Waves co-developed WNX7000 in partnership with Realtek Semiconductor, one of the world's leading network and multimedia IC providers, creating a high definition audio DSP chip embedded with Waves Nx technology. A complete Low Power DSP & Codec Hub audio solution with an integrated headphone amplifier.

Dirac Debuts Dirac Connect First On-Demand Cloud-Based Sound Optimization for Mobile Audio Solutions

February 27, 2017 by audioXpress Staff

Dirac Debuts Dirac Connect First On-Demand Cloud-Based Sound Optimization for Mobile Audio Solutions

Sound optimization on the cloud anyone? Swedish based Dirac Research promised innovations for the GSMA Mobile World Congress (MWC) 2017 in Barcelona, and delivered in a big way. In a world first for the audio industry, now both users and manufacturers will be able to benefit from processing technologies including Dirac Power Sound, Dirac Panorama Sound, Dirac HD Sound and Dirac Sensaround, directly through Dirac Connect, the first cloud-based sound optimization service for mobile devices, headphones and wireless speakers.

VESA Highlights Growing DisplayPort Alt Mode Adoption and Latest DisplayPort Developments at Mobile World Congress 2017

February 27, 2017 by audioXpress Staff

VESA Highlights Growing DisplayPort Alt Mode Adoption and Latest DisplayPort Developments at Mobile World Congress 2017

The Video Electronics Standards Association (VESA) announced that, thanks to escalating adoption by OEMs and chipmakers, the DisplayPort standard is continuing to gain momentum in the mobile consumer electronics space. Much of this recent growth stems from adoption of the DisplayPort Alternate Mode (“Alt Mode”) that is supported by dozens of commercially available products to date using the new USB Type-C connector.

Waves Nx VR and MaxxVoice Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

February 24, 2017 by audioXpress Staff

Waves Nx VR and MaxxVoice Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

Cadence Design Systems and Waves Audio announced the availability of the Waves Nx Virtual Reality Audio Technology on the Cadence Tensilica HiFi 3 DSP for Audio, Voice, and Speech. The Waves Nx solution, which delivers high-quality VR audio and true 5.1 or 7.1 surround with a minimal resource footprint, will be demonstrated at the Cadence booth at Mobile World Congress in Barcelona, February 27 to March 2, 2017, in Hall 6, Stand 6L36.

Dirac Promises Major Product Introductions At Mobile World Congress 2017

February 22, 2017 by audioXpress Staff

Dirac Promises Major Product Introductions At Mobile World Congress 2017

Sound optimization technology experts Dirac Research announced the introduction of two new audio solutions that help transform nearly any mobile device and headphone into an on-the-go home theatre. The two solutions — the brand new Dirac VR and a second-generation Dirac Panorama Sound — will be formally unveiled and demonstrated at Mobile World Congress (MWC) 2017.

HEAD acoustics Presents Improved Speech and Audio Analysis Systems at MWC 2017

February 21, 2017 by audioXpress Staff

HEAD acoustics Presents Improved Speech and Audio Analysis Systems at MWC 2017

Speech and audio quality specialists, HEAD acoustics GmbH from Herzogenrath, Germany, will be presenting its range of solutions at the Mobile World Congress (February 27 to March 2, 2017). Like many key development technology companies, HEAD acoustics will use the Barcelona show to demonstrate a new evaluation software of VoCAS (Voice Control Analysis System), as well as an update of its communication analysis software ACQUA 3.5.100.

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