All items tagged with MediaTek (29)

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

November 21, 2023 by audioXpress Staff

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

MediaTek, one of the first adopters of the upcoming Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with the introduction of the latest Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

Creative Technology Launches LE Audio Ready Wireless Headphones

September 13, 2023 by Joao Martins

Creative Technology Launches LE Audio Ready Wireless Headphones

Creative Technology released its all-new range of Creative Zen Hybrid Pro wireless headphones and their accompanying bundles, the Creative Zen Hybrid Pro Classic and Creative Zen Hybrid Pro SXFI. Equipped with nifty features such as Hybrid Active Noise Cancellation (ANC) and Ambient Mode, a powerful 40mm Neodymium driver, and an impressive battery life of up to 100 hours, these latest headphones are also Bluetooth LE Audio Ready, thanks to the latest Airoha LE Audio (Mediatek) platform.

MediaTek Enhances On-Device Generative AI Processing

August 28, 2023 by Cristina Costa

MediaTek Enhances On-Device Generative AI Processing

MediaTek is already powering more than two billion connected edge devices every year and now the company confirmed that it is working closely with Meta's Llama 2 next-generation open-source Large Language Model (LLM). Combining this recently announced LLM with its latest APUs and NeuroPilot AI Platform, MediaTek aims to build a complete edge computing ecosystem designed to accelerate AI application development on smartphones, consumer connected devices, vehicles, smart home, etc.

MediaTek Partners With NVIDIA to Provide Platform Roadmap to the Automotive Industry

May 29, 2023 by Cristina Costa

MediaTek Partners With NVIDIA to Provide Platform Roadmap to the Automotive Industry

MediaTek announced a partnership with NVIDIA to deliver a complete range of in-vehicle computing and advanced AI cabin solutions for the next generation of software-defined vehicles. The collaboration combines the strength of each company's automotive portfolios to deliver solutions for state-of-the-art connected cars integrating NVIDIA GPU chiplets into the MediaTek Dimensity Auto platform.

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

September 19, 2022 by Joao Martins

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

Taiwan-based Airoha Technology announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process and will be "widely available" to manufacturers in the first half of 2023. Airoha is one of the most important suppliers of chips for true wireless earbuds and the LE Audio certification is also an important R&D achievement for its Bluetooth audio R&D team consisted of hundreds of engineers.

MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets

August 22, 2022 by Joao Martins

MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets

MediaTek, the semiconductor company from Taiwan, and Fraunhofer IIS, primary developer of the MPEG-H 3D Audio standard, have once again collaborated for bringing the most advanced audio experience to consumer homes. In January 2022, MPEG-H Audio was selected by the SBTVD Forum as the sole mandatory audio codec for the TV 3.0 Brazilian broadcast system. MediaTek has now integrated MPEG-H Audio into its Pentonic series.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

Wireless Innovation Accelerates in 2022 with Wi-Fi 6 and UWB

November 23, 2021 by audioXpress Staff

Wireless Innovation Accelerates in 2022 with Wi-Fi 6 and UWB

According to global technology intelligence firm ABI Research, 2022 will represent a key year for wireless connectivity innovation as Wi-Fi 6, 6E, and Ultra-Wideband adoption accelerates across a growing number of end markets. The latest wireless technologies will see strong double-digit growth as 6 GHz Wi-Fi 6E shipments triple in the next year, reaching well over 1.5 billion annual chipset shipments. Ultra-Wideband (UWB) devices are expected to reach nearly half-a-billion units as adoption increases within smartphones, wearables, speakers, personal trackers, and location tracking (RTLS) applications, forecasts ABI Research.

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