Qualcomm Snapdragon Sound: Questions, Development, Audio Momentum and the Market

In early March 2021, following a series of announcements in development platforms and solutions for wireless audio, Qualcomm announced Qualcomm Snapdragon Sound, a new end-to-end approach to promote high-resolution digital audio and enhanced voice communications across devices. The systems' approach combines and optimizes multiple Qualcomm technologies for mobile platforms, processing, connectivity, plus the latest aptX Adaptive audio technologies needed to improve the sound experience for consumers. But how can manufacturers and new brands benefit? Will there be a lossless extension for aptX Adaptive? We asked the questions to Jonny McClintock, Director of aptX Sales & Marketing at Qualcomm.

Ellisys released a broad complement of innovative features to support development of emerging Bluetooth LE Audio products, including controllers, stacks, and devices. These features, available on the company's Bluetooth protocol analysis systems, broaden support for the latest Bluetooth LE Audio specifications and deliver unique technical innovations that solve complex issues for developers.

Tempow, the Bluetooth-specialist, Paris-based startup, announced a new partnership with Zhuhai Jieli Technology, a leading chipset manufacturer in the TWS Bluetooth SoC segment. Jieli Technology is joining Tempow's chipset partner program to deploy TempowOS, an operating system for True Wireless Earbuds, on its flagship AC897N and AD697N extreme low power Bluetooth TWS solutions.

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.

This article from Vincent Nallatamby, CEO of Tempow, a Paris-based startup discusses the potential of Bluetooth LE Audio to improve true wireless stereo applications. Tempow is a research and design lab focused on pushing the limits of Bluetooth technology. The company's first product, the Tempow Audio Profile (TAP) is an updated Bluetooth protocol allowing any Bluetooth chip to stream audio on multiple Bluetooth audio outputs simultaneously. The company also released a Bluetooth Software Stack for LE Audio, the next generation of Bluetooth audio.

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.