All items tagged with LC3 codec (43)

Bluetooth SIG Announces Completion of LE Audio Specifications

July 12, 2022 by Joao Martins

Bluetooth SIG Announces Completion of LE Audio Specifications

The Bluetooth Special Interest Group (SIG), the trade association that oversees Bluetooth technology, announced the completion of the full set of specifications that define LE Audio, the next generation of Bluetooth audio - originally announced in January 2020. The release of this set of specifications will finally enable manufacturers to design and release products supporting the full scope of improvements promised for the next-generation Bluetooth audio, including Auracast broadcast audio.

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

May 20, 2022 by Cristina Costa

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

The next generation of wireless audio projects is now getting on the bench, as developers get access to the first Bluetooth LE Audio evaluation platforms. Nordic Semiconductor has long been a reference in Bluetooth development platforms and has now released its nRF5340 Bluetooth LE Audio DK board, which includes everything required for developers to take advantage of the latest Bluetooth standard, including LC3 codec, low power consumption, and wireless stereo enhancements.

Bluetooth SIG Market Update on LE Audio Specification

March 31, 2022 by Joao Martins

Bluetooth SIG Market Update on LE Audio Specification

The Bluetooth SIG published its latest Bluetooth Market Update. And we learn that the LE Audio specification project is nearing completion... and should be ready this year. Will everyone just wait? This article looks at the llatest Bluetooth Market Update, which confirms that wireless audio streaming is still the largest Bluetooth solution application area by far, and is bound to grow even more thanks to LE Audio. But everything is taking a bit longer than expected and not everyone is happy...

The Standards We Need. A Review of the Book "Introducing Bluetooth LE Audio" by Nick Hunn

January 20, 2022 by Joao Martins

The Standards We Need. A Review of the Book "Introducing Bluetooth LE Audio" by Nick Hunn

This article is a review of the recently distributed book, Introducing Bluetooth LE Audio, by Nick Hunn, Chair of the Bluetooth SIG Hearing Aid Working Group, Vice Chair of the Generic Audio Working Group and a key contributor to the Bluetooth LE Audio specifications. This is an important book for everyone who wants to understand Bluetooth LE Audio. But has the industry momentum for Bluetooth LE Audio been lost? Two years after the original Bluetooth LE Audio announcement in 2020, all we have is a Book.

CEVA Bluetooth Dual Mode 5.3 Platform Now SIG Qualified for Wireless Audio

January 13, 2022 by audioXpress Staff

CEVA Bluetooth Dual Mode 5.3 Platform Now SIG Qualified for Wireless Audio

CEVA announced that its RivieraWaves Bluetooth Dual Mode 5.3 Platform has achieved Bluetooth SIG Qualification, along with its GAF (Generic Audio Framework) and LC3 codec. As the first IP company to receive Bluetooth Dual Mode 5.3 qualification, CEVA brings the latest improvements in Bluetooth connectivity and LE Audio to the market, lowering the entry barriers for semiconductors and OEMs targeting LE Audio applications. 1 billion CEVA-powered Bluetooth devices are estimated to have shipped in 2021.

Laird Connectivity and Packetcraft Launch New Bluetooth LE Audio Evaluation Kits for Connected Audio Applications

November 26, 2021 by Joao Martins

Laird Connectivity and Packetcraft Launch New Bluetooth LE Audio Evaluation Kits for Connected Audio Applications

Laird Connectivity partnered with Packetcraft to offer a complete Bluetooth LE Audio evaluation kit using Laird's BL5340 Bluetooth 5.2 development boards, a custom audio interface board, and Packetcraft’s comprehensive software solution for LE Audio. This development solution is ideal for developers looking to evaluate LE Audio for emerging next generation Bluetooth LE Audio applications, such as wireless microphones, broadcast audio for infrastructure, and much more.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Packetcraft Announces Bluetooth 5.3 Qualification and LC3 Codec for LE Audio

October 5, 2021 by audioXpress Staff

Packetcraft Announces Bluetooth 5.3 Qualification and LC3 Codec for LE Audio

Wireless software licensor Packetcraft, Inc. announced its Packetcraft Controller software has achieved Bluetooth 5.3 qualification, including the world’s first qualification of new Bluetooth 5.3 link layer technical features. Packetcraft also announced the availability of Packetcraft LC3, a highly optimized and efficient LC3 codec for Bluetooth LE Audio.

T2 Software Qualifies First Bluetooth LE Audio Host Stack

September 24, 2021 by audioXpress Staff

T2 Software Qualifies First Bluetooth LE Audio Host Stack

T2 Software announced the Bluetooth SIG qualification and listing of their Bluetooth LE Audio Host Stack. With OEM's and semiconductor companies all busy building LE Audio solutions, T2 Software was the first company to fully qualify all of the adopted profiles and services supporting Bluetooth LE Audio. The team has been working closely with the Bluetooth SIG over a period of three years.

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