All items tagged with Headphone 3.0 (9)

Sonical and Sigma Connectivity Accelerate Hearables Product Development

April 2, 2024 by Joao Martins

Sonical and Sigma Connectivity Accelerate Hearables Product Development

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps has confirmed a development partnership with Sigma Connectivity, the leading Swedish technology design and engineering house. Sigma will help Sonical accelerate the market transition to Headphone 3.0 and the adoption of user driven wearable audio devices.

Sonical Headphone 3.0 Platform Supports Cingo Dynamic Spatial Audio Technology From Fraunhofer

December 28, 2023 by Joao Martins

Sonical Headphone 3.0 Platform Supports Cingo Dynamic Spatial Audio Technology From Fraunhofer

In anticipation of an exciting showcase planned for CES 2024 - mostly restricted to manufacturers and technology providers interested in exploring the Headphone 3.0 approach - Sonical has confirmed a new strategic partnership. The company headquartered in Silicon Valley is working with Fraunhofer IIS to offer its Cingo binaural rendering and Spatial Audio technology running on Sonical CosmOS, specifically designed for hearables with downloadable plugins.

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

December 11, 2023 by Joao Martins

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps, will partner with XMOS for its Headphone 3.0 demonstrations at CES 2024. The two companies will showcase a first joint development that will greatly enhance wireless audio quality with huge benefits to the feature set in Sonical's roadmap.

AES New York 2023 Convention Promotes UWB Workshop, Friday, October 27

October 18, 2023 by Joao Martins

AES New York 2023 Convention Promotes UWB Workshop, Friday, October 27

The Audio Engineering Society created a new Task Group to develop a new standard for Ultra Wideband (UWB) high resolution, low latency audio. During the 155th AES New York 2023 Convention (October 25-27), a dedicated workshop will detail the potential of UWB for audio, and this new AES effort. Titled "UWB – A New Wireless Tech in the Future of Pro Audio" the panel will include Jackie Green (UWB Alliance), Jonny McClintock (AntennaWare/Audio Codecs), Gary Spittle (Sonical), Torbev Sonderskov (Lenbrook), and Alexis Bizalion (Qorvo).

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

September 13, 2023 by Joao Martins

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

Sonical, the Headphone 3.0 pioneer based in San Mateo, CA, and IDUN audio, the leading-edge startup from Copenhagen, Denmark, specializing in dynamic spatial audio for headphones, have formalized a strategic partnership. The two companies have been cooperating since 2022, and IDUN audio was part of the Sonical CES 2023 demos, with its dynamic spatial audio software running on Sonical's headphone operating system CosmOS - enabling unsurpassed spatialization with fast head tracking.

Hearables, Headphones Testing, Audio Electronics, and More in audioXpress April 2023

March 10, 2023 by audioXpress Staff

Hearables, Headphones Testing, Audio Electronics, and More in audioXpress April 2023

Want to understand what's ahead in the most revolutionary audio product category of the 21st century? Read the State of the Hearables Industry Market Update. And for product developers and manufacturers, there's also a Headphones Test and Measurement report. Burkhard Vogel discusses op-amp noise in simulated models, Bruce E. Gillingham offers a complete monoblock power amplifier project, and René Christensen writes about acoustic topology optimization. And so much more....

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

February 16, 2023 by Joao Martins

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

What happened at CES 2023 related to wireless audio and Bluetooth LE Audio. And what might happen at MWC 2023. And why there's lots more happening in assistance, hearables, and Headphones 3.0. This article discusses Bluetooth LE Audio and Android 13. Bluetooth 5.4 updates. Sennheiser's MobileConnect Assistive Listening app that actually works over Wi-Fi. Sonical, Antennaware, et all, Headphone 3.0. UWB, and high-quality wireless audio. Originally published in The Audio Voice 410, February 16 2023.

Sonical Partners With Dolphin Design to Develop the Silicon for Open Hearables

September 5, 2022 by Joao Martins

Sonical Partners With Dolphin Design to Develop the Silicon for Open Hearables

Sonical, the Silicon Valley company developing an open software platform for hearables, announced a partnership with Dolphin Design, a leading edge computing and embedded AI silicon IP company, and a subsidiary of Soitec, an industry leader in designing and manufacturing innovative semiconductor materials. Together, the two companies are working on a heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will change the end-user experience with hearables.

A Computer in Every Ear. The Rise of Headphone 3.0

September 1, 2022 by Joao Martins

A Computer in Every Ear. The Rise of Headphone 3.0

Enter Sonical Headphone 3.0. A fully integrated approach for the product development of headphones and earbuds that allows consumers to load their own apps. audioXpress talked to Gary Spittle, the CEO and founder of Sonical, a young company that developed a chip and a real-time operating system for headphones and hearables. "Hearables should not be defined by the functions of a chip or the Bluetooth profiles, there is a lot more that product makers want to do," says Gary Spittle, the CEO and founder of Sonical.