All items tagged with engineering services (15)

Grinn Unveils AstraSOM-1680 Edge AI Module

December 4, 2024 by Joao Martins

Grinn Unveils AstraSOM-1680 Edge AI Module

Grinn, an electronics design and engineering development house, announced the launch of its latest System on Module, the Grinn AstraSOM-1680, powered by the advanced Synaptics Astra SL1680 embedded processor. The Grinn AstraSOM-1680 is a compact, high-performance module designed to bring new capabilities to edge devices, enabling smart camera applications and AI-intensive applications such as Natural Language Processing.

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

December 3, 2024 by Joao Martins

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

As a leading engineering house for audio development, supplying software and hardware solutions for connected audio products, StreamUnlimited relies on a series of development modules that respond to all major application areas and form-factors. The company now reengineered its hardware modules to ensure extended longevity and that modules remain compatible with advancing technologies, enabling manufacturers to extend product lifecycles and provide greater value to end-users.

Cardinal Peak Opens Dante Development Center in Vietnam

November 8, 2024 by audioXpress Staff

Cardinal Peak Opens Dante Development Center in Vietnam

Cardinal Peak announced a strategic partnership with Audinate to establish a Dante Development Center in Vietnam. The new development center will offer custom Dante development expertise to OEMs and hardware manufacturers, speeding up time to market. The collaboration will also accelerate the integration of Audinate's Dante audio and video solutions for manufacturers through Cardinal Peak’s extensive engineering services expertise.

Sonical and Sigma Connectivity Accelerate Hearables Product Development

April 2, 2024 by Joao Martins

Sonical and Sigma Connectivity Accelerate Hearables Product Development

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps has confirmed a development partnership with Sigma Connectivity, the leading Swedish technology design and engineering house. Sigma will help Sonical accelerate the market transition to Headphone 3.0 and the adoption of user driven wearable audio devices.

CUI Devices Launches New Audio Design Services

February 27, 2024 by audioXpress Staff

CUI Devices Launches New Audio Design Services

Oregon-based CUI Devices’ Audio Group announced the official launch of its new audio design services, with a team of sound specialists that are able to leverage advanced simulation tools and testing as well as decades of expertise to support developers and brands. Even for companies with their own in-house resources this level of support is able to optimize a range of audio parameters to specific system needs.

Cardinal Peak and Audinate Announce Strategic Partnership Dante Networked Audio and Video Solutions

January 24, 2024 by Joao Martins

Cardinal Peak and Audinate Announce Strategic Partnership Dante Networked Audio and Video Solutions

Cardinal Peak, the recognized product design and engineering services provider, and Audinate, the developer of Dante audio networking technology, have announced a strategic development partnership aimed at reducing time to market and development costs for new Dante-enabled pro audio and video products. With more manufacturers interested in Dante integration in a growing number of products, Cardinal Peak will support product engineering efforts.

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

Redrock Acoustics Relaunches Loudspeaker Testing Services

November 20, 2023 by audioXpress Staff

Redrock Acoustics Relaunches Loudspeaker Testing Services

Redrock Acoustics, the company founded by Patrick Turnmire, announced the launch of a new website that also signals the return of the company to offering loudspeaker testing services. Renowned for offering engineering and design services, Redrock Acoustics is again opening access to services that include Klippel testing and transducer analysis. Visitors to the new website will find information about all services, and the SpeaD transducer development software, as well as other design tools.

October 4, 2023 by Joao Martins

ICEpower Signs an Investment Agreement with Crestline

Danish audio amplifier company ICEpower has signed a definitive agreement with Crestline Investors, for an investment in a majority stake in the company. Crestline, headquartered in the US, is an institutional alternative investment management firm with over $16 billion in assets under management. ICEpower's management aims to accelerate the company's global growth strategy as a "preferred partner for outsourced product creation to the leaders of the audio industry."

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

August 3, 2023 by audioXpress Staff

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

Virscient, announced a new strategic collaboration with Infineon to support customers' design-in of Infineon’s connectivity products. Under this agreement, Virscient will provide expert design and engineering services, and licensable software solutions to help innovative OEMs and platform vendors rapidly deliver products integrating Infineon's AIROC Wi-Fi + Bluetooth combo ICs – whether chip-down, or in modular form.

«
1
2
»