Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface

As the connected devices market enters a new era of connectivity with Bluetooth 5.0, Dialog Semiconductor announced the next generation in its SmartBond family – DA14586. The all-new System-on-Chip (SoC) is the company’s first standalone device that is qualified to support the latest Bluetooth 5.0 specification, delivering the lowest power consumption and unrivalled functionality for advanced use cases.

Dialog Semiconductor announced the availability of its latest Apple HomeKit development kit, to reduce the time-to-market and increase functionality of smart home and other Internet of Things (IoT) devices. Dialog’s second-generation kit supports all current HomeKit Accessory Profiles within Apple’s updated IoT platform. The kit itself is built on Dialog’s SmartBond DA14681 System-on-Chip (SoC), the most integrated single chip solution that is purpose-built for IoT development, providing connectivity to a variety of battery-powered devices.

Dialog Semiconductor announced the DA14195, an open audio platform IC for active headphones. The DA14195 offers a new route to next generation active headphone development. This end-to-end digital SoC with built in advanced audio processing heightens performance and defines a new standard for headset functionality and sound quality. Dialog Semiconductor’s new DA14195 combines extremely low power consumption with impressive processing performance in a small 0.4 mm pitch WLCSP package.