All items tagged with chipset (9)

WiSA Partners with Realtek to Develop and Launch a 5GHz Multichannel Immersive Audio Module

January 20, 2022 by Joao Martins

WiSA Partners with Realtek to Develop and Launch a 5GHz Multichannel Immersive Audio Module

WiSA, the Wireless Speaker and Audio Association, a wholly-owned subsidiary of Summit Wireless Technologies, announced plans to integrate WiSA’s multichannel wireless audio capabilities - and its latest high-performance Spatial Audio Software - into Realtek’s 5GHz IoT chipsets. The partnership will culminate in a cost-effective module capable of delivering uncompressed, high-definition spatial audio streams for an unparalleled immersive audio experience.

MaxLinear WAV600 Series-2 Chipset Selected for Wi-Fi Alliance Wi-Fi 6 Release 2 Certification Test Bed

January 6, 2022 by Cristina Costa

MaxLinear WAV600 Series-2 Chipset Selected for Wi-Fi Alliance Wi-Fi 6 Release 2 Certification Test Bed

MaxLinear, the provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, headquartered in Carlsbad, California, announced that their WAV600 Series-2 Chipset SoCs have been selected as access point test bed devices for the Wi-Fi Alliance Wi-Fi CERTIFIED 6 Release 2 certification process. The test bed uses a MaxLinear WAV615 and two MaxLinear WAV665 Wi-Fi Transceiver SoCs to enable tri-band interoperability testing at 2.4GHz, 5GHz, and 6GHz, delivering on performance and increased network capacity.

Noveto Completes Chipset Development to Drive SmartBeaming Technology

August 20, 2021 by Joao Martins

Noveto Completes Chipset Development to Drive SmartBeaming Technology

Noveto, the company responsible for the development of one of the most promising audio technologies, with large implications in multiple markets, including mobile and automotive industries, confirmed the successful completion of its proprietary new C1 chipset. The development is designed to drive its SmartBeaming technology, a speaker that dynamically tracks and beams audio to the user's ears, creating a personal audio zone.

Noveto Promotes SoundBeamer Headphones Alternative on Kickstarter

February 19, 2021 by Joao Martins

Noveto Promotes SoundBeamer Headphones Alternative on Kickstarter

Noveto is the Israeli company that successfully demonstrated its sound-beaming technology for web conferencing and automotive zoning applications at CES 2018, and more recently partnered with electronics giant Foxconn to bring to market its own audio chipset. Now, the company launched a limited pre-sale Kickstarter campaign to bring to market a proof-of-concept of its technology with the SoundBeamer 1.0 integrated speaker.

Dirac and Sudio Work on New Cutting-Edge True Wireless Stereo Earbuds with Spatial Audio

January 28, 2021 by audioXpress Staff

Dirac and Sudio Work on New Cutting-Edge True Wireless Stereo Earbuds with Spatial Audio

Swedish digital audio processing pioneer Dirac and Sudio, a designer and manufacturer of premium headphones and speakers, also from Sweden, announced that the two companies are collaborating to integrate Dirac’s patented sound optimization and spatial audio technology into next-generation Sudio true wireless earbuds. The project will be Sudio's first Dirac-enabled product, scheduled for release in Summer 2021.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

September 30, 2020 by audioXpress Staff

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

Swedish digital audio pioneer Dirac announced that its latest spatial audio solution, which leverages the company's patented Dynamic HRTF technology, is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. The solution is now compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers, independent of playback devices or media players.

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

April 16, 2020 by audioXpress Staff

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

According to data from the GSMA, the world will see 3.2 billion cellular Internet-of-Things (IoT) connections in 2024. That is, billions of connected devices of all types in homes, companies, and cities. Qualcomm Technologies is already a leading supplier of wireless connectivity chipsets and they now announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, introduced as the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

January 14, 2020 by audioXpress Staff

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Tempow, the company that specializes in software-only solutions to enhance the core Bluetooth protocol, announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. The company also announced a partnership program for chipset manufacturers to use Tempow’s implementation. Telink Semiconductor was the first to join the program.