Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

Audinate, the developer of the Dante audio-over-IP networking solution that now also carries video, announced that its Dante Brooklyn 3 audio networking module is now shipping. Announced in June at InfoComm 22, the new module is a pin-compatible replacement for one of Audinate’s most popular products, the Dante Brooklyn 2, which has been redesigned to ensure continuous availability while delivering support for current and future Dante features.

Addressing one of the most important, complex, and dynamic commercial issues impacting the global audio and video industry, during InfoComm 2022 Audinate announced the actions the company has been taking to minimize and mitigate the impact of global supply issues. In addition, as part of its strategy to ensure availability of product, the company announced next generation, drop-in replacements for its popular Brooklyn and Fremont modules.

CEVA announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021. The acquisition allows CEVA to offer IP, software and chip development.