All items tagged with Bluetooth 5.3 (78)

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

March 24, 2023 by Joao Martins

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

Offering enhanced connectivity and streaming features, Synaptics latest SYN4382 Triple Combo offers Matter-compliant Wi-Fi 2.4/5/6/6E, Bluetooth 5.3, and IEEE 802.15.4 wireless, with the ability for simultaneous operation of two radios and multiple Bluetooth channels to stream multimedia content. This state-of-the-art system-on-chip enables new exciting audio and video experiences, while lowering power consumption, cost, and system complexity.

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

March 16, 2023 by audioXpress Staff

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

The new STM32 Bluetooth wireless module from STMicroelectronics lets designers access the advantages of ST’s dual core STM32WB microcontrollers (MCUs), especially in projects intended for low-to-medium production volumes. The module simplifies development and accelerates time to market, combining Bluetooth Low Energy 5.3 certification and worldwide radio-equipment approvals with the STM32Cube ecosystem support.

U-blox IRIS-W1 Tri-Radio Stand-Alone Module Features Dual-Band Wi-Fi 6, Bluetooth LE 5.3 and Matter Support

March 15, 2023 by audioXpress Staff

U-blox IRIS-W1 Tri-Radio Stand-Alone Module Features Dual-Band Wi-Fi 6, Bluetooth LE 5.3 and Matter Support

U-blox has announced IRIS-W1, its first compact stand-alone Wi-Fi module combining dual-band Wi-Fi 6, Bluetooth LE (Low Energy) 5.3, and Thread including support for Matter. IRIS-W1 comes in four variants, each enabling the user to select among various antennas and software environments. The u-blox IRIS-W1 offers a powerful wireless MCU and delivers high-standard security to support a wide range of market segments.

Creative Announces Stage SE Under-Monitor Soundbar with Bluetooth 5.3 and USB Digital Audio

March 14, 2023 by Alfred Moody

Creative Announces Stage SE Under-Monitor Soundbar with Bluetooth 5.3 and USB Digital Audio

Soundbars have originally conquered the living room to compensate for the poor sound in very thin TVs, and evolved in meeting rooms by gaining microphones and conferencing features. At the same time, under-monitor soundbars are gaining popularity for both gaming and working from home. Creative Technology announced the release of Creative Stage SE, the fourth and smallest under-monitor soundbar in this series, designed to amp up the user’s desktop audio experience.

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

March 6, 2023 by Cristina Costa

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

Infineon Technologies announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth 5.3 combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products. The CYW43022 ultra-low power architecture delivers industry-leading performance, with up to a 65 percent reduction in power usage during "deep sleep," significantly extending battery life for applications in connected smart home devices and wearables.

EarFun Claims World's 1st Bluetooth LE-Audio ANC True Wireless Earbuds

February 27, 2023 by Joao Martins

EarFun Claims World's 1st Bluetooth LE-Audio ANC True Wireless Earbuds

EarFun has launched the new Air Pro 3 true wireless earbuds that are said to be LE Audio-ready. audioXpress has waited until the start of MWC 2023 in Barcelona to see if anyone would dispute or make a similar claim. Since no one did, we can reliably publish the story now. Earfun is now selling the World's 1st LE-audio ANC true wireless earbuds, the brand's new TWS earbud flagship, which uses the Qualcomm QCC 3071 chip, and also supports Bluetooth 5.3, and aptX Adaptive.

Creative Introduces Outlier Free Series of Wireless Bone Conduction Headphones

February 17, 2023 by Joao Martins

Creative Introduces Outlier Free Series of Wireless Bone Conduction Headphones

Offering two different models with Bluetooth 5.3, one with IPX8 waterproof rating and the other with IPX5 water-resistant rating, Creative Technology introduced its Creative Outlier Free series of bone conduction headphones. The Creative Outlier Free and Free Pro (waterproof) models are very similar designs to the Shokz models that are now highly recognized in the category, and both are targeted at serious sport and fitness enthusiasts.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

Audeze New Maxwell Planar Magnetic Wireless Gaming Headphones Support LE Audio and LC3plus

December 8, 2022 by Joao Martins

Audeze New Maxwell Planar Magnetic Wireless Gaming Headphones Support LE Audio and LC3plus

Audeze announced Maxwell, a new ultra-low-latency wireless headset with class-leading 80+ hours of battery life, which comes with a Dolby Atmos license for select compatible platforms. With the new model, Audeze introduced a new upgraded, retro-looking earcup design for its planar magnetic drivers. The new design is also its ugliest product ever, but at least it already supports Bluetooth LE Audio, adds support for the LC3plus codec, and offers high-resolution audio over USB-C.

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

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