All items tagged with automotive (255)
DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver
February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.
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Noveto Promotes SoundBeamer Headphones Alternative on Kickstarter
February 19, 2021 by Joao Martins

Noveto Promotes SoundBeamer Headphones Alternative on Kickstarter

Noveto is the Israeli company that successfully demonstrated its sound-beaming technology for web conferencing and automotive zoning applications at CES 2018, and more recently partnered with electronics giant Foxconn to bring to market its own audio chipset. Now, the company launched a limited pre-sale Kickstarter campaign to bring to market a proof-of-concept of its technology with the SoundBeamer 1.0 integrated speaker.
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DSP Concepts Opens Advanced Design Center in Mexico
February 17, 2021 by audioXpress Staff

DSP Concepts Opens Advanced Design Center in Mexico

DSP Concepts, maker of the Audio Weaver platform and a leading company in embedded audio development, announced it has opened a design center in Queretaro, Mexico. The center is host to a team of engineers that are focused on audio for automotive and consumer electronics, with an emphasis on customer engagement, product development, and test and validation. DSP Concepts plans to double the headcount in Queretaro by the end of 2021.
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Microchip Unveils First Fully Integrated Solution for Vehicle Ethernet Audio Video Bridging (AVB)
February 12, 2021 by audioXpress Staff

Microchip Unveils First Fully Integrated Solution for Vehicle Ethernet Audio Video Bridging (AVB)

As connected vehicles increasingly rely on Ethernet for network connectivity, smart technology is helping developers to streamline infotainment system development and quickly adapt to manufacturers’ evolving requirements. Microchip Technology announced the first hardware-based audio endpoint solution for AVB – the LAN9360, a single chip Ethernet controller with embedded protocols. The new LAN9360 AVB audio endpoint helps to reduce development time, eliminating the need for stack integration and additional software and firmware development.
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Tektronix Offers IEEE 802.3ch Multi-Gigabit Ethernet Compliance Test Solution
February 12, 2021 by Cristina Costa

Tektronix Offers IEEE 802.3ch Multi-Gigabit Ethernet Compliance Test Solution

Tektronix announced the launch of its TekExpress Multi-Gigabit Automotive Ethernet Compliance Test Solution as the first-in-market solution to meet the requirements of complex automotive designs. As newer automotive technologies such as autonomous driving, 5G and connected car solutions develop, the paths carrying the vast amount of data necessary to support those technologies must be tested to ensure reliable transfers between a vehicle’s electronic sub-systems.
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Sound United Uniquely Positioned for Automotive Market Growth With Acquisition of Bowers & Wilkins
February 8, 2021 by audioXpress Staff

Sound United Uniquely Positioned for Automotive Market Growth With Acquisition of Bowers & Wilkins

Following the recent Bowers & Wilkins acquisition, Sound United LLC, parent company to Denon, Marantz, Polk Audio, Definitive Technology, Classé, and Boston Acoustics, announced its intent to capitalize on Bowers & Wilkins’ in-depth knowledge of the automotive audio industry to expand its development into the growing automotive market. "Bowers & Wilkins’ heritage of automotive audio excellence empowers Sound United with deep well of knowledge, bettering its position for growth," the company states.
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Resonado Labs Announces Flat Core Speaker Technology Debut in Airstream Touring Coaches
February 3, 2021 by audioXpress Staff

Resonado Labs Announces Flat Core Speaker Technology Debut in Airstream Touring Coaches

Resonado Labs announced its proprietary Flat Core Speaker (FCS) technology will soon be available to consumers in the recreational vehicle (RV) industry. The novel speaker technology developed by the Chicago-based audio startup will first be implemented in iconic travel brand Airstream's 2022 Touring Coach model line. The launch will represent the first commercial implementation of FCS technology into an established consumer product line, and in automotive audio.
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Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform
January 27, 2021 by Joao Martins

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

Qualcomm Technologies and Amazon announced new joint efforts to pre-integrate the Alexa Custom Assistant with the Qualcomm Snapdragon Automotive Cockpit Platforms - the new-generation of automotive-optimized SoCs from Qualcomm. This new system is designed to support automotive OEMs and Tier-1 suppliers to build customizable, in-vehicle intelligent assistants and is offered as an extension module to the Alexa Automotive Software Development Kit (SDK).
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In-Car Voice Controls Must Be Context-Based to Offer Best User Experience Finds Strategy Analytics
January 22, 2021 by audioXpress Staff

In-Car Voice Controls Must Be Context-Based to Offer Best User Experience Finds Strategy Analytics

As voice controls are fast becoming a primary interaction modality of choice in-vehicle, Strategy Analytics identified that context is key in user experience. Automakers of all types have largely aligned on touchscreen and voice control as the primary modalities for infotainment HMI. While touch-and-voice-centric HMI has achieved a majority market penetration in all major markets, China in particular spearheads voice as the primary modality in many verticals.
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CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family
January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.
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