All items tagged with automotive (262)

Realtek Semiconductor and Alango Technologies Partner to Offer Advanced Solution for In-Car Communication

July 12, 2024 by Joao Martins

Realtek Semiconductor and Alango Technologies Partner to Offer Advanced Solution for In-Car Communication

Realtek Semiconductor and Alango Technologies, have announced a collaboration to deliver a joint solution aimed at facilitating In-Car Communication (ICC) between the driver and passengers to improve safety, convenience, and overall satisfaction during travel. According to Alango, the solution uses its ICC software package ported and optimized for the Realtek ALC5575 audio processor. The Alango ICC technology suite running on ALC5575 was successfully demonstrated by Realtek to Computex visitors in June 2024.

Dirac Promotes IAMF Demonstration with Google Open Media and Vaudeville Sound at the 2024 AES Conference on Automotive Audio

July 2, 2024 by Joao Martins

Dirac Promotes IAMF Demonstration with Google Open Media and Vaudeville Sound at the 2024 AES Conference on Automotive Audio

Swedish audio DSP pioneer Dirac promoted a demonstration of the world's first in-car IAMF spatial audio installation in cooperation with Google Open Media and sound design house Vaudeville Sound. The Immersive Audio Model and Formats container format is being promoted for User Generated Content (UGC) and professional audio applications, as an open format alternative, which Google will support for Youtube content. Dirac setup an immersive system on a Volvo to showcase the potential applications for automotive.

Harman Opens Consumer Audio Engineering Lab in Denmark and New Factory in Thailand

June 21, 2024 by Joao Martins

Harman Opens Consumer Audio Engineering Lab in Denmark and New Factory in Thailand

Harman International Industries has opened an Audio Engineering Lab in Kvistgaard, Denmark, aiming to research and develop new headphone audio technologies. Harman's newest audio lab, dedicated to hearables development, is the first of its kind in Europe, benefiting from pool of audio and acoustic engineers that graduate from Denmark universities, among other advantages. Harman also announced a new manufacturing facility in Thailand, to support Harman's portfolio of automotive and components solutions.

HEAD acoustics' MOBILITY Voice and Noise Conference 2024

June 6, 2024 by Roger Shively

HEAD acoustics' MOBILITY Voice and Noise Conference 2024

audioXpress attended the HEAD acoustics' MOBILITY Voice and Noise Conference 2024 (May 8-9, 2024). An immersive event with the most advanced solutions and an application-based approach for testing and evaluating sound for automotive. On the southern shore of the Golden Gate strait, located on the headlands of the San Francisco Peninsula inside the Presidio, not far from the historic Officer's Club, HEAD acoustics hosted this conference as a way to provide an updated and practical look at all automotive and mobility voice and noise applications.

Cambridge GaN Devices Expands GaN-based 140-240W USB-PD Development

May 30, 2024 by Joao Martins

Cambridge GaN Devices Expands GaN-based 140-240W USB-PD Development

Cambridge GaN Devices (CGD), the British fabless semiconductor company, dedicated to develop energy-efficient GaN-based power devices that make greener electronics possible, has signed a Memorandum of Understanding with Industrial Technology Research Institute (ITRI) of Taiwan to develop high performance GaN solutions for USB-Power Delivery (USB-PD) adaptors. The MoU also covers the sharing of domestic and international market information, joint visits to potential customers and promotion.

TDK Introduces Ultra-Thin Noise Suppression Permalloy Sheets

May 21, 2024 by Joao Martins

TDK Introduces Ultra-Thin Noise Suppression Permalloy Sheets

TDK Corporation extended its Flexield family of permalloy thin film sheets with the new IPM01 series, which features high-permeability and high loss in a lightweight and 0.006 mm ultra-thin design. This new material made possible due to TDK's proprietary manufacturing method, effectively shields lower-frequency band noise, which is becoming a growing issue in electric vehicles (EVs). Mass production of the product began May 2024.

SoundHound AI and Perplexity Partner to Enable Large Language Models in Next-Generation Voice Assistants

May 9, 2024 by audioXpress Staff

SoundHound AI and Perplexity Partner to Enable Large Language Models in Next-Generation Voice Assistants

SoundHound AI, a pioneer in voice artificial intelligence, announced that it has partnered with Perplexity, the conversational AI-powered answer engine. Together the two companies plan to bring Perplexity’s online Large Language Models (LLM) capabilities to SoundHound Chat AI – a new generation of voice assistant that utilizes hundreds of real-time domains, as well as generative AI responses.

Sennheiser Enhances the Sound Experience in the New Morgan Plus Four

April 26, 2024 by audioXpress Staff

Sennheiser Enhances the Sound Experience in the New Morgan Plus Four

Sennheiser Mobility continues its partnership that started with the Morgan Plus Four introduced in 2022, now with the latest Morgan Plus 4 Model. Sennheiser contributed with an upgraded sound experience with new technology to the latest Plus Four. The new Sennheiser audio system features a series dynamic and technological enhancements, intensified to contribute to the immersive driving experience.

Digigram Expands with Acquisition of Noise and Vibration Testing Systems Specialist OROS

April 12, 2024 by audioXpress Staff

Digigram Expands with Acquisition of Noise and Vibration Testing Systems Specialist OROS

Digigram has acquired Grenoble-based OROS, also a French company specializing in noise and vibration testing systems. This acquisition by the audio over IP solutions company expands the Digigram Group's build-up strategy focused on critical audio applications. OROS high end solutions meet the requirements and expectations of automotive, aerospace, marine energy & process, manufacturing and automation industries. The amount of the transaction has not been disclosed.

Microchip Releases Qi v2.0 Standards-Compliant Wireless Dual-Pad Reference Design

March 20, 2024 by Cristina Costa

Microchip Releases Qi v2.0 Standards-Compliant Wireless Dual-Pad Reference Design

As major charger manufacturers, including those in the automotive industry, are working to implement Qi v2.0 (Qi2) standards, Microchip Technology has released a Qi2 dual-pad wireless power transmitter reference design. The new wireless dual-pad charging design - using fully-automotive qualified Microchip components - supports both Qi2's Extended Power Profile and Magnetic Power Profile with a single controller.

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