All items tagged with ZigBee (43)

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.

Synaptics Launches Veros High-Performance Wireless Combo SoCs

October 17, 2024 by audioXpress Staff

Synaptics Launches Veros High-Performance Wireless Combo SoCs

Synaptics launched the Veros Seamless Intelligent Connectivity brand with two high-performance systems on chip (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. The two new wireless combo chips from Synaptics, the SYN4383 triple combo (Wi-Fi/Bluetooth/802.15.4) and tri-band (2.4GHz, 5GHz, 6GHz ), and the SYN43756E, also a multi-protocol, tri-band solution that offers a cost-effective version aimed at products not requiring 802.15.4 support, enable product developers to integrate essential wireless protocols including Bluetooth LE Audio.

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

April 22, 2024 by Cristina Costa

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

Silicon Labs has announced its most energy-efficient Wireless SoC to date with energy harvesting-ready capabilities. To signal Earth Day 2024, Silicon Labs launched its new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E, with "E" standing for "energy conservation."

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

STMicroelectronics Introduces Secure Wireless Microcontrollers Supporting Matter and Bluetooth LE Audio

March 6, 2024 by Cristina Costa

STMicroelectronics Introduces Secure Wireless Microcontrollers Supporting Matter and Bluetooth LE Audio

STMicroelectronics has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable advanced smart home and audio applications, with more miniaturized, efficient, secure and affordable designs. The new STM32WBA ecosystem offers full support and integration of Bluetooth Low Energy 5.4, Zigbee, and Thread stacks, and enables new LE Audio and Auracast applications.

Naim Unveils Uniti Nova Power Edition All-in-One Player

February 8, 2024 by audioXpress Staff

Naim Unveils Uniti Nova Power Edition All-in-One Player

Naim launched its new Uniti Nova PE (Power Edition) all-in-one player, an elegant design that is also able to drive the best and more demanding hifi loudspeakers effortlessly. The British brand excels in the creation of high-end hifi systems, and this high-resolution audio player and 150W stereo amplifier is an ideal all-round solution to bring music to any home or office.

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

March 16, 2023 by audioXpress Staff

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

Silicon Labs continues to expand its range of wireless solutions for connected devices, and during Embedded World 2023 in Germany, the company introduced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).

«
1
2
3
4
5
»