All items tagged with MEMS sensors (17)

MEMS Microphones and Speakers Forecasted to Become a $20 Billion USD Industry in 2024

December 6, 2019 by audioXpress Staff

MEMS Microphones and Speakers Forecasted to Become a $20 Billion USD Industry in 2024

French market research firm Yole Développement just published its 2019 report on Microphones, Microspeakers, and Audio Solutions – Market and Technology Trends. The new report characterizes the main drivers behind the exponential growth in MEMS microphone applications and emerging MEMS speaker technologies, growth opportunities such as voice at the heart of new audio system applications, or the impact of Artificial Intelligence (AI) in the audio value chain.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

February 20, 2019 by audioXpress Staff

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.

Bosch Sensortec Launches New Generation of Smart Sensor Hubs for Hearables

July 9, 2018 by audioXpress Staff

Bosch Sensortec Launches New Generation of Smart Sensor Hubs for Hearables

During the Sensors Expo (June 27-28) in San Jose, California, Bosch Sensortec announced the BHI260 and BHA260, the first two members of a new generation of smart sensor hubs. These new devices are optimized for 24/7, always-on sensor processing and feature ultra-low power consumption, and a high performance co-processor, ideal for the development of new wearables, hearables, AR/VR and other mobile devices and battery-operated devices.

MEMS for Mobile Devices: Global Market Report 2017-2021

March 14, 2018 by audioXpress Staff

MEMS for Mobile Devices: Global Market Report 2017-2021

ResearchAndMarkets.com just announced a new market report focusing on the "Global MEMS Market for Mobile Devices 2017-2021." According to the research firm, the global MEMS market for mobile devices is set to grow at a CAGR of 10.55% during the period 2017-2021. The report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years, and includes a discussion of the key vendors operating in this market.

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

February 28, 2018 by audioXpress Staff

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.

COMSOL Announces Integration of Simulation and 3D Design in the Latest Version of LiveLink for Solidworks

February 4, 2016 by audioXpress Staff

COMSOL Announces Integration of Simulation and 3D Design in the Latest Version of LiveLink for Solidworks

The latest release of COMSOL Multiphysics provides capabilities for building custom simulation applications. With LiveLink for Solidworks and the Application Builder from COMSOL it’s now possible to build applications that integrate simulation and 3D design. The software integrates highly productive model building, app design based on COMSOL models created from a Solidworks software geometry.

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