All items tagged with IoT (57)

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

April 16, 2020 by audioXpress Staff

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

According to data from the GSMA, the world will see 3.2 billion cellular Internet-of-Things (IoT) connections in 2024. That is, billions of connected devices of all types in homes, companies, and cities. Qualcomm Technologies is already a leading supplier of wireless connectivity chipsets and they now announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, introduced as the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.

CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz

February 20, 2020 by audioXpress Staff

CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and Rohde & Schwarz, a leading supplier of test and measurement equipment, announced that CEVA has successfully completed Protocol Conformance testing of the CEVA-Dragonfly NB2 IP platform for Narrowband IoT Release 14 as defined by the Global Certification Forum (GCF). The comprehensive testing was performed using the Rohde & Schwarz R&S CMW500 wideband radio communication tester, a GCF validated platform for NB-IoT protocol conformance testing.

R&D Stories: Achieving Frictionless Lower-Power Application Connectivity with Data-Over-Sound

December 5, 2019 by Adib Mehrabi

R&D Stories: Achieving Frictionless Lower-Power Application Connectivity with Data-Over-Sound

Anytime we need to login to the local Wi-Fi or pair with another Bluetooth device, we think, "There must be a better way to do this!" That's precisely one of the exciting possibilities for data-over-sound technology. This article explains what else we can do with it, and how it works. It also explores how data-over-sound can be realized in embedded scenarios, and how Chirp’s new technology, using the Arm Cortex-M4 and Cortex-M7 processors, can be implemented in connected products. This article was originally published in audioXpress, November 2019.

u-blox Acquires Rigado’s Bluetooth Modules Business

August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.

Wi-Fi Celebrates 20 Years with More Than 20 Billion Anticipated Device Shipments over the Next Six Years

June 14, 2019 by audioXpress Staff

Wi-Fi Celebrates 20 Years with More Than 20 Billion Anticipated Device Shipments over the Next Six Years

More than 20 billion Wi-Fi devices are forecasted to ship between 2019 and 2024, according to a new market data report from global tech market advisory firm, ABI Research. Continued growth in traditional markets of strength, alongside traction in mesh networking systems, smart home, automotive, and IoT applications will drive the Wi-Fi market forward to nearly 4 billion annual device shipments by 2024.

LEA Professional Launches New Technology Platform and First Low Power, Connected Amplifiers

June 13, 2019 by audioXpress Staff

LEA Professional Launches New Technology Platform and First Low Power, Connected Amplifiers

As highly anticipated, LEA Professional was the focus of attention as soon as InfoComm 2019 opened its doors in Orlando, introducing its professional-grade IoT (Internet of Things) technology platform with the launch of the LEA Connect Series amplifier family. As promised, LEA wants to bring the benefits of a connected world to the Professional A/V market, allowing system designers and integrators to provide real-time system performance coverage to their existing service contacts.

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

May 31, 2019 by Cristina Costa

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

Lattice Semiconductor announced the availability of the HM01B0 UPduino Shield, a comprehensive development kit for implementing Artificial Intelligence (AI) computing in devices using vision and sound as sensory inputs. This rapid prototyping board, in the Arduino form factor, includes components designers need to quickly develop always-on, low power smart IoT and connected devices. This new development kit consists of a Lattice iCE40 UltraPlus FPGA-based Upduino 2.0 board and a Himax HM01B0 image sensor module.

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

November 16, 2018 by Cristina Costa

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

Renesas Electronics unveiled an innovative energy-harvesting embedded controller that can eliminate the need to use or replace batteries in connected devices. Developed based on Renesas' breakthrough SOTB (silicon-on-thin-buried-oxide) process technology, the new embedded controller achieves extreme reduction in both active and standby current consumption, a combination that was not previously possible to achieve in conventional microcontrollers (MCUs).

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

October 24, 2018 by Cristina Costa

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

Atmosic Technologies, a startup company from Saratoga, California, announced what the company claims to be the industry’s lowest power wireless Bluetooth 5 platform, allowing manufacturers to deliver extended battery life and battery-free connected devices. Atmosic's inaugural M2 and M3 series SoC's will be able to power all sorts of low-power designs and deliver energy harvesting for connected devices.

NFC Forum Boosts Smart Home IoT with Thread Group Liaison Agreement

September 20, 2018 by audioXpress Staff

NFC Forum Boosts Smart Home IoT with Thread Group Liaison Agreement

The NFC Forum and the Thread Group announced that they have formed an official partnership by signing a liaison agreement. The goal of the agreement is to provide a new Internet of Things (IoT) user interface experience (UX) by using Near Field Communication (NFC) technology when installing and configuring a device to a Thread network. The organizations plan to collaborate on how NFC technology can be deployed as part of the IoT device installation, configuration and commissioning process on a Thread network.

«
1
2
3
4
5
6
»