All items tagged with Bluetooth SIG (38)

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

September 24, 2020 by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.

Fraunhofer IIS Licenses LC3 Audio Codec Software to Microsoft

July 10, 2020 by audioXpress Staff

Fraunhofer IIS Licenses LC3 Audio Codec Software to Microsoft

The Fraunhofer Institute for Integrated Circuits IIS announced the licensing of its LC3 software implementation to Microsoft Corp. LC3 (Low Complexity Communication Codec) is the audio codec adopted for Bluetooth LE Audio, a new audio architecture designed to boost the performance of Bluetooth Audio – for voice calls as well as for media playback including music. Following the news that Microsoft had licensed the xHE-AAC codec and MPEG-D DRC software implementation from Fraunhofer IIS, the addition of LC3 is a logic step.

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

March 19, 2020 by audioXpress Staff

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

Cinemas, gamers and the hard of hearing could all benefit from Bluetooth 5.2, according to the latest "Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast" report from SAR Insight & Consulting. Bluetooth will continue to be a popular and flexible way to connect devices, thanks in part to the technology being refreshed to remain relevant to component manufacturers and consumers, says SAR Insight & Consulting.

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.

The True Potential of True Wireless Earbuds

January 30, 2020 by Vincent Nallatamby

The True Potential of True Wireless Earbuds

This article from Vincent Nallatamby, CEO of Tempow, a Paris-based startup discusses the potential of Bluetooth LE Audio to improve true wireless stereo applications. Tempow is a research and design lab focused on pushing the limits of Bluetooth technology. The company's first product, the Tempow Audio Profile (TAP) is an updated Bluetooth protocol allowing any Bluetooth chip to stream audio on multiple Bluetooth audio outputs simultaneously. The company also released a Bluetooth Software Stack for LE Audio, the next generation of Bluetooth audio.

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

January 7, 2020 by audioXpress Staff

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.

CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP

January 30, 2019 by audioXpress Staff

CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP

CEVA announced the general release of its RivieraWaves Bluetooth 5.1 IP and multiple license agreements already signed with leading semiconductor companies. Supporting the headline new feature of Direction Finding via Angle of Arrival (AoA) and Angle of Departure (AoD) for enhanced location services, the RW-Bluetooth 5.1 IP is available in both Bluetooth Dual Mode and Bluetooth Low Energy flavors.

Bluetooth Special Interest Group Introduces Location Services with Bluetooth 5.1 Specification

January 29, 2019 by audioXpress Staff

Bluetooth Special Interest Group Introduces Location Services with Bluetooth 5.1 Specification

The Bluetooth Special Interest Group (SIG) announced a new direction finding feature that holds the potential to significantly enhance the performance of Bluetooth location services solutions, down to centimeter-level location accuracy. The new feature, included in version 5.1 of the Bluetooth Core Specification, allows devices to determine the direction of a Bluetooth signal, thereby enabling the development of Bluetooth proximity solutions that can understand device direction as well as Bluetooth positioning systems.

Peter Liu from Bose and Ron Wong from Cypress Semiconductors Appointed to Bluetooth SIG Board of Directors

July 11, 2018 by audioXpress Staff

Peter Liu from Bose and Ron Wong from Cypress Semiconductors Appointed to Bluetooth SIG Board of Directors

The Bluetooth Special Interest Group (SIG) announced that Peter Liu, Architect of Wearable Systems at Bose, and Ron Wong, Director, Product Marketing in the Microcontroller & Connectivity Division of Cypress Semiconductor will be joining the board of directors of the Bluetooth SIG as Associate Member Directors. The Bluetooth SIG Board of Directors is responsible for the governance of the organization and plays a vital role in driving the expansion of Bluetooth technology to address the needs of a growing number of consumer and commercial markets.

«
1
2
3
4
»