Searched for: IoT
AudioTelligence Announces Orsana LE Audio Assistive Listening Device
by Joao Martins

AudioTelligence Announces Orsana LE Audio Assistive Listening Device

AudioTelligence launched Orsana, a demonstration device of an assistive listening solution to help users hear clearly in noisy environments, with hearing aids or consumer TWS earbuds. Orsana connects wirelessly to Bluetooth LE Audio enabled earbuds or hearing aids – and can be used by up to 6 people at the same time. The device is available for hearing aid and consumer electronics companies interested in implementing their own assisted listening solutions.
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AES Announces Detailed Program Schedule for 154th AES Europe 2023 Convention
by Audio Engineering_Society

AES Announces Detailed Program Schedule for 154th AES Europe 2023 Convention

The Audio Engineering Society has released Technical Program details for the upcoming AES Europe 2023 Convention, being held at Aalto University, Espoo, Helsinki, Finland, May 13 – 15. Full details of the schedule, full slate of research paper presentations, along with workshop details, session content and presenters reveal extensive insights into the latest audio technologies and techniques. The interactive online schedule also includes abstracts for all sessions.
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New Renesas RISC-V Voice-Control ASSP Allows Differentiated Applications with Voice Recognition
by Cristina Costa

New Renesas RISC-V Voice-Control ASSP Allows Differentiated Applications with Voice Recognition

Renesas extended its RISC-V embedded processing portfolio with the first RISC-V MCU designed for voice-controlled HMI (human-machine interface) systems. The new R9A06G150 32-bit ASSP (Application Specific Signal Processor), developed in collaboration with RISC-V ecosystem partners, provides a complete, cost-effective, production-ready voice-control system solution that eliminates the need for RISC-V tools and upfront software investment.
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Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases
by Joao Martins

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

Offering enhanced connectivity and streaming features, Synaptics latest SYN4382 Triple Combo offers Matter-compliant Wi-Fi 2.4/5/6/6E, Bluetooth 5.3, and IEEE 802.15.4 wireless, with the ability for simultaneous operation of two radios and multiple Bluetooth channels to stream multimedia content. This state-of-the-art system-on-chip enables new exciting audio and video experiences, while lowering power consumption, cost, and system complexity.
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Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
by audioXpress Staff

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

Silicon Labs continues to expand its range of wireless solutions for connected devices, and during Embedded World 2023 in Germany, the company introduced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
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SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development
by Joao Martins

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

SPARK Microsystems announced the closing of CDN $34 million Series B financing, with an additional CDN $14 million available subject to meeting operational milestones. Led by Idealist Capital, a prominent investment firm focused on the energy transition and decarbonization, the round includes existing investors Cycle Capital, Economic Development Canada (EDC), Real Ventures, and ND Capital. The new funding will drive mass market commercialization for ultra-energy efficient, UWB-based wireless electronic devices and sensors.
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GreenWaves Ramps Up Production of GAP9 Hearables Platform
by Joao Martins

GreenWaves Ramps Up Production of GAP9 Hearables Platform

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.
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Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs
by Cristina Costa

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

Infineon Technologies announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth 5.3 combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products. The CYW43022 ultra-low power architecture delivers industry-leading performance, with up to a 65 percent reduction in power usage during "deep sleep," significantly extending battery life for applications in connected smart home devices and wearables.
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L-Acoustics Named One of the World’s Most Innovative Companies for 2023
by audioXpress Staff

L-Acoustics Named One of the World’s Most Innovative Companies for 2023

After being named to the Most Innovative Companies list in 2020, French audio manufacturer L-Acoustics is again recognized as an industry trailblazer in 2023. L-Acoustics has been named for the second time to Fast Company’s prestigious annual list of the World’s Most Innovative Companies in the Live Events category. This year’s Fast Company list highlights the businesses at the forefront of their respective industries, paving the way for innovation, and setting the standard with some of the greatest accomplishments of the modern world.
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Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona
by Joao Martins

Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona

In 2022, the Bluetooth Special Interest Group (SIG) announced the Auracast extension of the Bluetooth LE Audio specifications, combining audio sharing and broadcast audio into a new term that would make it easier to promote. The audio innovation promises to propel audio streaming forward by letting users share their audio or select from publicly available Auracast wireless audio streams. At Mobile World Congress (MWC) 2023 in Barcelona the technology was demonstrated in a practical manner for the very first time.
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