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Nexperia Announces 80% Smaller Automotive Power MOSFET Package
by Cristina Costa

Nexperia Announces 80% Smaller Automotive Power MOSFET Package

Nexperia, the former Standard Products division of NXP, announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally-enhanced, loss-free package which has a footprint more than 80 percent smaller than industry standard devices. LFPAK33 MOSFETs enable the power infrastructure that allows next-generation automotive subsystems such as infotainment technology to operate reliably and efficiently.
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Ultra Low Power MCU Enables 10 Times System-Level Power Savings and Floating-Point Operation in IoT Applications
by Cristina Costa

Ultra Low Power MCU Enables 10 Times System-Level Power Savings and Floating-Point Operation in IoT Applications

Analog Devices announced an ultra low power microcontroller unit (MCU) that addresses the rapidly growing need for embedding advanced algorithms while consuming the lowest system power at Internet of Things (IoT) edge nodes. The ADuCM4050 MCU includes an ARM Cortex-M4 core with floating-point unit, expanded SRAM, and embedded flash memory in order to allow localized decision making and ensuring that only the most important data is sent to the cloud.
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Sennheiser and Pink Floyd Create Unique Immersive Live Experience of Comfortably Numb Live in AMBEO 3D
by audioXpress Staff

Sennheiser and Pink Floyd Create Unique Immersive Live Experience of Comfortably Numb Live in AMBEO 3D

The mastermind producers behind the brand new AMBEO Mix for The Pink Floyd Exhibition: Their Mortal Remains, Senior Sound Engineers Simon Rhodes and Simon Franglen came together to remix the last live performance of Pink Floyd. Using the AMBEO 3D Audio Technology in the Abbey Road Studio Two, they are working on a sound experience which allows the audience to hear more details of the song and walk around inside the music of Pink Floyd.
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InfoComm International Names Heidi Voorhees Chief Operating Officer
by audioXpress Staff

InfoComm International Names Heidi Voorhees Chief Operating Officer

InfoComm International announced Heidi A. Voorhees, MBA, CAE, as the organization's new Chief Operating Officer. As COO, Voorhees will lead InfoComm's North American operations and global marketing and communication efforts. With 20 years of trade association and private business experience, Voorhees brings to InfoComm significant expertise in operations management and strategic planning.
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Universal Audio Releases UAD Software v9.1 with New Plug-Ins, Expanded Support for Windows 10 and macOS
by audioXpress Staff

Universal Audio Releases UAD Software v9.1 with New Plug-Ins, Expanded Support for Windows 10 and macOS

Universal Audio announced the release of its new UAD Software v9.1, now with Apollo multi-unit support over Thunderbolt for Windows 10 systems, Console 2 software support to users of multiple Apollo FireWire interfaces and fully qualified macOS Sierra for all Apollo and UAD-2 platforms. The professional audio recording hardware and software manufacturer also announced bountiful new plug-ins from SSL, Moog, Softube, and Brainworx.
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New 3.5mm Jack Interface Lets Smart Active Noise Cancellation (ANC) Headsets Run Battery-Free
by audioXpress Staff

New 3.5mm Jack Interface Lets Smart Active Noise Cancellation (ANC) Headsets Run Battery-Free

ams announced the launch of a technology which enables noise-cancelling headsets with a four-pole 3.5mm jack to operate for the first time without a dedicated battery power supply. The new Accessory Communication Interface (ACI), invented by ams, uses a single wire to carry power and bidirectional data as well as digital audio signals, enabling small form factor noise cancellation headsets while offering the flexibility to include sensors, LEDs and displays.
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Thomas Gmeiner Joins USound as Vice President Global Program Management and Business Development
by audioXpress Staff

Thomas Gmeiner Joins USound as Vice President Global Program Management and Business Development

Austrian manufacturer and supplier of MEMS-based audio systems, USound, has extended its management team with Thomas Gmeiner, who was appointed as USound Vice President Global Program Management and Business Development. A former Knowles and AKG executive with more than 20 years experience in the audio industry, Thomas Gmeiner reinforces USound in a critical moment for the company, about to release its patented thin-film piezo-electric MEMS micro-speaker technology.
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STMicroelectronics Teams with DSP Concepts to Give STM32 Users Free Access to Advanced Audio Design Tool
by audioXpress Staff

STMicroelectronics Teams with DSP Concepts to Give STM32 Users Free Access to Advanced Audio Design Tool

The new ST-AudioWeaver free development tool from STMicroelectronics streamlines and simplifies development of embedded audio applications for richer user interfaces in smart devices using 32-bit ARM Cortex-M based STM32 microcontrollers. Developed in cooperation with DSP Concepts, creator of the Audio Weaver design suite, the tool contains library of 160 audio algorithms, with GUI for configuring and fine-tuning.
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Swiss Companies Introduce the World Smallest Bluetooth Chip
by audioXpress Staff

Swiss Companies Introduce the World Smallest Bluetooth Chip

Integrated in the “Swiss Silicon Valley”, the Swatch Group introduced a new Bluetooth integrated circuit, designed 100% by EM Microelectronic, Swatch Group R & D and the Swiss Center for Electronics and Microtechnology (CSEM). The EM9304 Bluetooth chip is already qualified against the new Bluetooth Version 5.0 standard. MSC Technologies, a company of Avnet, is already distributing the solution.
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Cypress Unveils Low Power MCU Architecture for Secure Devices
by Cristina Costa

Cypress Unveils Low Power MCU Architecture for Secure Devices

Cypress Semiconductor announced its newest microcontroller (MCU) PSoC 6 architecture that is purpose-built for the Internet of Things (IoT). The architecture is built on ultra-low-power 40-nm process technology, with integrated security features required for next-generation IoT devices. Featuring dual-core processing, the architecture fills a gap in the IoT solution space between power-hungry and higher-cost application processors and performance-challenged, single-core MCUs.
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