All items tagged with wireless earbuds (480)

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

February 24, 2023 by Mike Klasco

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.

xMEMS and Bujeon Launch 2-Way Hybrid MEMS Driver Solution for Hi-Res TWS Earbuds

February 22, 2023 by Joao Martins

xMEMS and Bujeon Launch 2-Way Hybrid MEMS Driver Solution for Hi-Res TWS Earbuds

xMEMS Labs and Bujeon Electronics have partnered to create a family of 2-way speaker modules to accelerate design of next generation high-resolution and lossless audio-capable TWS earbuds. The solution integrates a high-performance 9mm dynamic driver custom-designed by Bujeon with an xMEMS' Cowell tweeter, the world’s smallest monolithic MEMS microspeaker at just 22mm. The reference design combines an xMEMS Aptos MEMS speaker amplifier to create a "drop-in" solution compatible with today’s leading TWS system-on-chips.

HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

February 14, 2023 by Joao Martins

HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

As many audioXpress readers already learned from reading the article by Hans W. Gierlich on the Benefits of Using Structure-Borne Sound in Headset Signal Processing, HEAD acoustics created a complete test solution for in-ear and headset devices using bone-conduction sensors. There are good reasons for developers and manufacturers to explore the use of bone-conduction sensors and test them with the new ViBRIDGE solution.

Atlantic Technology Unveils First True Wireless Earbuds

February 13, 2023 by Joao Martins

Atlantic Technology Unveils First True Wireless Earbuds

Atlantic Technology's first foray into the competitive true wireless stereo market is an interesting case study. The Massachusetts-based audio company known for its stereo and home theater speakers, and custom audio installation systems, has brought to market the TWS-1 Total Wireless Earbuds, an interesting premium product with ANC, advanced performance and convenience features, including an app to optimize the sound profile to the user’s hearing.

Bowers & Wilkins Announces Second Generation Pi7 and Pi5 True Wireless Earbuds

January 26, 2023 by Joao Martins

Bowers & Wilkins Announces Second Generation Pi7 and Pi5 True Wireless Earbuds

The original Bowers & Wilkins Pi7 & Pi5 noise cancelling earbuds, launched in April 2021, marked the British audio brand’s first entry into the true wireless category. Trying to redefine audio quality in the form-factor, apparently the company decided the brand's goals could be improved and introduced two new upgraded models, the Pi7 S2 and Pi5 S2. Replacing the first-generation models, the two new designs reaffirm their ambition to be "the best-sounding True Wireless earbuds".

Creative Creates New Entry-Level ANC True Wireless Earbuds with SXFI

January 25, 2023 by audioXpress Staff

Creative Creates New Entry-Level ANC True Wireless Earbuds with SXFI

Creative Technology announced the launch of the Creative Zen Air, sporting a familiar but refined earbud design with a pocket-friendly, lightweight, Qi wireless charging case. For a record-low price of US $44.99, these true wireless earbuds come with Active Noise Cancellation and Ambient Mode, offer great audio quality with large dynamic drivers, and decent battery life. They also support Creative's Super X-Fi for binaural enhancement, providing an overall great true wireless experience.

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

January 19, 2023 by audioXpress Staff

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

Swedish digital audio processing pioneer Dirac and leading multinational chipset maker BES announced a partnership to pre-integrate the Dirac Virtuo and Dirac Opteo software onto BES chipsets to be used by leading headphone manufacturers to deliver optimized performance in any headphone type. The announcement was made at CES 2023, where it was confirmed that boAt, Monoprice, and Sudio are the first headphone brands to leverage these Dirac-enabled BES chipsets in their devices.

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

January 13, 2023 by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

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