All items tagged with wireless earbuds and TWS (107)

QCY and USound Announce New High Volume TWS Product Featuring USound MEMS Speakers Set to Launch in 2025

March 3, 2025 by Joao Martins

QCY and USound Announce New High Volume TWS Product Featuring USound MEMS Speakers Set to Launch in 2025

USound, the Austrian specialist in micro-electromechanical systems (MEMS), announced a new design win with QCY, a recognized Chinese manufacturer of wireless audio products. QCY has officially announced the development of a new TWS earbuds design featuring USound MEMS drivers, set to launch in 2025. By partnering closely with Dongguan Hele Electronics, the parent company of QCY, USound was able to confirm that a new TWS model will soon enter production in 2025.

R&D Stories: Pushing the Boundaries of Active Noise Cancellation

January 29, 2025 by Stefan Liebich and Johannes Fabry

R&D Stories: Pushing the Boundaries of Active Noise Cancellation

Detailing a different perspective on signal processing, Stefan Liebich and Johannes Fabry bring us the story of how Elevear is exploring what is possible with Active Noise Cancellation (ANC). Offering a great overview about how signal processing works for ANC and transparency in true wireless earbuds, the two Elevear technical minds share their perspective on how the technology roadmap is taking us in exciting directions.

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

December 23, 2024 by Joao Martins

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

To be unveiled at CES 2025 is a new example of a MEMS microspeaker company that now offers an integration with a MEMS microphone. SonicEdge, the startup that pioneered ultrasound MEMS drivers and has yet to enter the market, will present SonicTwin, an integrated speaker-microphone in a single package. Combining the company's patented modulated ultrasound technology that eliminates traditional mechanical vibrations, makes the integration with a microphone and sensors much easier with potential benefits also for ANC and lower-power in TWS earbuds and headphones.

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.

beyerdynamic Introduces New Flagship Wireless Headphones and TWS Earbuds

September 9, 2024 by Joao Martins

beyerdynamic Introduces New Flagship Wireless Headphones and TWS Earbuds

During IFA 2024, beyerdynamic introduced two new additions to its wireless headphones and earbuds lineup. The all-new flagship AVENTHO 300, packed with advanced features, hybrid ANC, and Dolby Head Tracking technology, now leads beyerdynamic’s headphone range, while the AMIRON 300 offers a fresh approach to the company's true wireless stereo (TWS) earbuds. Both products represent a bold reinvention of the AVENTHO and AMIRON lines, combining cutting-edge wireless technology and chipsets with premium materials.

JBL Tour PRO 3 with Advanced Smart Charging Case Lead the Next Generation of TWS Earbuds

August 21, 2024 by Joao Martins

JBL Tour PRO 3 with Advanced Smart Charging Case Lead the Next Generation of TWS Earbuds

Harman unveiled its new flagship true wireless earbuds, JBL Tour PRO 3. The most advanced design from the brand, the JBL Tour PRO 3 combine dual drivers per earbud with JBL Spatial 360 with Head Tracking, True Adaptive Noise Cancellation 2.0, AI-based voice call processing, and a Smart Charging Case packing truly unique features and already supporting Auracast. A product that is set to redefine the user experience in this extremely competitive category.

Bowers & Wilkins Launches New Pi6 and Pi8 True Wireless ANC Earbuds

August 21, 2024 by Joao Martins

Bowers & Wilkins Launches New Pi6 and Pi8 True Wireless ANC Earbuds

Bowers & Wilkins introduced two all-new premium True Wireless earbuds, the Pi6 and Pi8, developed by the same design and engineering teams responsible for the brand's Px7 S2e and Px8 headphones. Coming from the renowned audio brand, the two models are focused on sound quality, combining fit and comfort, excellent noise cancellation and premium aesthetics. Based on Qualcomm's latest chipsets, the Pi6 and Pi8 earbuds offer a great combination of premium technologies and features, including the innovative Pi8 Smartcase.

SiliconIntervention: Low-Level Efficiency Improvements in Class-D

July 18, 2024 by Jan Didden

SiliconIntervention: Low-Level Efficiency Improvements in Class-D

Driven by the need to maximize battery life in portable devices, Class-D efficiency at low output levels is receiving greater attention. This is particularly important to achieve longer battery life in designs such as true wireless earbuds. Power optimized amplification is precisely the goal for Multilevel Class-D, and now there's also Fractal Class-D, a new technology developed by SiliconIntervention, a Canadian company formed in 2019 as the result of the pioneering research and development of its founder Martin Mallinson, the former Chief Scientist at ESS Technology.

Samsung Unveils New Galaxy Buds 3 and Galaxy Buds 3 Pro

July 16, 2024 by Joao Martins

Samsung Unveils New Galaxy Buds 3 and Galaxy Buds 3 Pro

Samsung promoted its Galaxy Unpacked event in Paris to unveil its latest range of folding smartphones, Galaxy Z Fold 6 and Galaxy Z Flip 6, two new smart watches, and a smart ring. Included in the series of announcements was the unveiling of Samsung's latest Galaxy Buds 3 Series true wireless earbuds, which surprised everyone for the radical departure from its original design in the previous generations. The new Galaxy Buds 3 and Galaxy Buds 3 Pro now look exactly like the earbud shapes of the AirPods.

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

July 15, 2024 by Joao Martins

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

Aizip and Bosch Sensortec jointly received the 2024 Best of Sensors Award at the Sensors Converge Conference and Expo (June 24-26) for a noise reduction solution in hearables devices. The award recognized the fact that Aizip's ZenVoice Bone algorithm, coupled with Bosch Sensortec's latest BMA550 bone conduction sensor, delivers advanced noise reduction in true wireless stereo (TWS) earbuds. This collaboration leverages Aizip's advanced neural network architecture to deliver a new level of speech intelligibility.

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