All items tagged with spatial audio (264)
L-Acoustics and Treble Technologies Announce Strategic Partnership and Investment
February 3, 2025 by audioXpress Staff

L-Acoustics and Treble Technologies Announce Strategic Partnership and Investment

L-Acoustics, the French manufacturer of professional sound systems and global market leader in the touring and large performance segment, announced its participation in Treble Technologies’ Series A funding round, alongside a strategic partnership between the two companies. Treble Technologies, based in Reykjavík, Iceland, is a pioneering leader in acoustic simulation, spatial audio and synthetic audio data generation.
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Holophonix Software Version 2.3 Expands Universal Compatibility and Integration for Immersive Audio Applications
February 3, 2025 by Joao Martins

Holophonix Software Version 2.3 Expands Universal Compatibility and Integration for Immersive Audio Applications

Holophonix will launch version 2.3 of its immersive audio software at ISE 2025 in Barcelona. The software, which is a free download to Holophonix users, features two key advancements: enhanced interoperability and an intuitive ‘Wizard’ that simplifies the user experience and streamlines workflows for audio professionals. Holophonix will be at booth #7J100 – Hall 7 exhibiting with its sister brand Amadeus.
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TDK Launches VibeSense360 Next-Generation TWS Motion Sensor Solution
January 21, 2025 by Joao Martins

TDK Launches VibeSense360 Next-Generation TWS Motion Sensor Solution

During CES 2025, TDK announced an enhanced next-generation InvenSense VibeSense360 motion sensor solution that will enable state-of-the-art spatial audio head tracking in new true wireless earbuds. The new VibeSense360 TWS solution includes motion sensor software, running on the latest SmartMotion ICM-45606 inertial measurement unit (IMU) that enables concurrent features of spatial audio, keyword assist, transparency for talk, head/UI gestures, and machine learning. The 220µA @50Hz 6-Axis IMU delivers industry-leading performance and battery life for TWS applications.
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CES 2025 First Impressions and Audio AI
January 16, 2025 by Joao Martins

CES 2025 First Impressions and Audio AI

A Celebration of the Art of the Possible. CES 2025 was extremely successful. Even with the impression of fewer people because of the show being even more dispersed. In this first impressions report we discuss how Edge-AI (on-device) is transforming what is possible in audio processing. And of course there was MagSafe and Qi2. USB4. Bluetooth LE Audio. Auracast. Wireless Multichannel. And much more. This is necessarily a brief first impressions editorial to follow up on a very intense edition of CES, where the business-to-business aspects of the show have intensified as predicted.
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MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences
January 9, 2025 by Joao Martins

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

Ceva and MediaTek announced a partnership to enhance the mobile entertainment experience, bringing the Ceva-RealSpace Elevate multichannel spatial audio with head tracking solution to the recently introduced MediaTek Dimensity 9400 flagship 5G smartphone chip using Bluetooth LE Audio. At CES 2025, Ceva demonstrated impressive spatial audio examples, creating a true-to-life listening experience beyond traditional stereo and surround sound systems on True Wireless Stereo (TWS) earbuds and headphones.
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JLab Unveils Epic Lux Lab Edition Wireless Headphones
January 7, 2025 by Joao Martins

JLab Unveils Epic Lux Lab Edition Wireless Headphones

JLab announced its most advanced wireless headphones ever with the launch of its new Epic Lux Lab Edition model. The new over-ear headphones made their debut at CES 2025, where they surprised positively for the balanced sound with custom dynamic drivers, adaptive noise cancellation, 90+ hours of playtime, clear call capability, and Bluetooth 5.4 connectivity. Interestingly, wireless charging is supported directly from the earcups, and the headphones come with an included charging dock.
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IDUN Audio Partners with Merry Electronics to Enable Spatial Audio in New Headphone Designs
December 17, 2024 by Joao Martins

IDUN Audio Partners with Merry Electronics to Enable Spatial Audio in New Headphone Designs

IDUN audio, the Danish embedded spatial audio technology specialists announced a strategic partnership with Taiwan-based Merry Electronics. IDUN audio will showcase three new spatial audio integrations for personal audio during CES 2025, all running on Merry's brand new reference designs for true wireless stereo (TWS) earbuds, a new OWS open ear clip solution, and the recently announced new dual driver headphones.
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Audioscenic Unveils Amphi Hi-D Multichannel 3D Sound Technology
December 6, 2024 by Joao Martins

Audioscenic Unveils Amphi Hi-D Multichannel 3D Sound Technology

Audioscenic announced Amphi Hi-D, a new multichannel, position-adaptive technology that takes 3D sound to a whole new level. Already recognized for its unique Amphi 2-channel, loudspeaker crosstalk cancellation technology that generates a convincing tridimensional soundfield, the UK-based audio technology innovator is now pioneering multichannel High-Dimensional 3D audio. Audioscenic will demonstrate the first implementation of Amphi Hi-D at CES 2025.
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xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025
December 3, 2024 by Joao Martins

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

Underscoring the potential of solid-state MEMS microspeakers over-the-ear headphones, xMEMS Labs and Merry Electronics announced they will demonstrate a new production-ready reference design at CES 2025. Targeting both premium wireless over-the-ear headphones and gaming applications, Merry highlights xMEMS’ patented 2-way module architecture as a way to improve spatial audio accuracy and reduce weight for gamers, among other benefits.
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Audioscenic Appoints John Croteau as Chairman
November 21, 2024 by audioXpress Staff

Audioscenic Appoints John Croteau as Chairman

Audioscenic, the innovative UK-based company that is taking tridimensional audio reproduction to new frontiers, announced the appointment of John Croteau, a veteran technology executive, as Chairman of its Board of Directors. Croteau brings an impressive track record of driving innovation and growth in the technology sector including his roles as GM at Analog Devices, Senior VP at NXP, CEO at MACOM, and currently as CEO at neural biosensor company Pison.
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