All items tagged with product development and developers (7)

Silicon Labs Opens Connectivity Lab in Boston for Real-World Matter Testing

June 23, 2023 by audioXpress Staff

Silicon Labs Opens Connectivity Lab in Boston for Real-World Matter Testing

Silicon Labs announced the opening of the new Silicon Labs Connectivity Lab in their Boston facility. The Connectivity Lab simulates a modern Smart Home, with a range of connected devices, applications, ecosystems, and networks. It offers developers an ideal environment to test their Matter prototypes, operating within real-world scenarios across a variety of protocols and device brands.

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

February 2, 2023 by Cristina Costa

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

STMicroelectronics continues to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster and with less complexity by aiding hardware and software decision-making. The STM32Cube.AI Developer Cloud opens access to an extensive suite of online development tools built around the industry-leading STM32 family of microcontrollers (MCUs). Benefits include access to online service to benchmark edge-AI models on STM32 boards.

OKdo Announces Partnership to Supply Single Board Computers and System on Modules

August 23, 2022 by Cristina Costa

OKdo Announces Partnership to Supply Single Board Computers and System on Modules

OKdo, the company that is part of RS Group, one of the largest global electronics omni-channel distributors, announced an exclusive partnership with Radxa, a leading design service provider, to manufacture and distribute ROCK Single Board Computers (SBCs) and ROCK System-on-Modules (SoMs). With the announcement, OKdo pivots its strategy to offer a powerful solution to the ongoing supply chain crisis to the engineering community.

SoundHound and Qualcomm Announce Strategic Agreement to Bring Voice AI Technology to Snapdragon Platforms

January 25, 2022 by audioXpress Staff

SoundHound and Qualcomm Announce Strategic Agreement to Bring Voice AI Technology to Snapdragon Platforms

SoundHound and Qualcomm announced a multi-year, joint agreement that will give app developers and device manufacturers access to an easy-to-deploy voice artificial intelligence (AI) solution running on Snapdragon platforms. The integration consists of SoundHound's automatic speech recognition, natural language understanding, and text-to-speech conversion software with select Snapdragon platforms from Qualcomm.

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

March 25, 2021 by audioXpress Staff

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

Ellisys released a broad complement of innovative features to support development of emerging Bluetooth LE Audio products, including controllers, stacks, and devices. These features, available on the company's Bluetooth protocol analysis systems, broaden support for the latest Bluetooth LE Audio specifications and deliver unique technical innovations that solve complex issues for developers.

Developers Get Easy Access to Amazon Voice Services with OKdo and Qualcomm

February 24, 2021 by Cristina Costa

Developers Get Easy Access to Amazon Voice Services with OKdo and Qualcomm

OKdo, the global technology company from Electrocomponents, announced it is now supplying the Qualcomm Home Hub 100 Development Kit for Amazon Voice Services (AVS), a ready to use environment for voice-controlled applications in connected devices. Based on Qualcomm’s highly integrated, multi-mode System-on-Chip (SoC), the QCA4020, the Home Hub 100 kit is provided with pre-integrated software support for AVS, to help kickstart the development of voice-controlled applications.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.