All items tagged with product development and Bluetooth 5.4 (9)

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.

Noble Unveils Five-Driver TWS Design With ANC and Personalization by Audiodo

November 26, 2024 by Joao Martins

Noble Unveils Five-Driver TWS Design With ANC and Personalization by Audiodo

Not a company that shies away from pushing the envelope on personal audio, Noble Audio just announced a world's first true wireless stereo design using five drivers - 1 dynamic, 1 planar, and 3 balanced armatures. Not an easy feat given that a true wireless relies only on a tiny battery. But the FoKus Rex5 earbuds also support Active Noise Cancelling and even features sound personalization, developed in collaboration with Audiodo.

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

IOT747 Releases Low 20ms Latency Mode for IDC777 Module

October 22, 2024 by Joao Martins

IOT747 Releases Low 20ms Latency Mode for IDC777 Module

IOT747 announced a new low latency feature for its IDC777 ultra-low power module. The IDC777 is a fully integrated dual mode LE Audio (LC3 Codec Auracast and Unicast) and Classic Bluetooth module, optimized for Bluetooth wireless audio designs. With this new 20ms low latency stereo mode, the IDC777 module supports even further flexibility for device customization, enabling applications for gaming and an improved experience for Auracast audio sharing and broadcasting.

Managing Expectations: The Bluetooth LE Audio Calendar

August 8, 2024 by Joao Martins

Managing Expectations: The Bluetooth LE Audio Calendar

Fear of Missing Out on Bluetooth LE Audio? Are We There Yet? How many more days? When should you trigger that OTA firmware update? Should you ship Auracast-enabled products now? Should you be the first? No one wants to be the first.

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

March 26, 2024 by Joao Martins

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.

Qualcomm Unveils S7 Pro Snapdragon Sound Platform With Micro-Power Wi-Fi and 24-bit/192kHz Lossless Streaming

October 24, 2023 by Joao Martins

Qualcomm Unveils S7 Pro Snapdragon Sound Platform With Micro-Power Wi-Fi and 24-bit/192kHz Lossless Streaming

During its Snapdragon Summit event Qualcomm unveiled the latest S7 and S7 Pro Gen1 Sound platforms, which will soon power a new generation of advanced audio products. The new platforms offer five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to the previous generation. A real differentiator is the use of micro-power Wi-Fi to extend wireless audio range and support for up to 192kHz lossless music quality in the S7 Pro.

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

June 21, 2023 by audioXpress Staff

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

Qualcomm Technologies International unveiled an addition to the Qualcomm S3 Gen 2 Sound platform portfolio. This newly enhanced solution is optimized for gaming and ready for use in dongles and adapters. It combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced.

EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast

March 13, 2023 by audioXpress Staff

EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast

At Embedded World 2023, Packetcraft announced their latest Bluetooth 5.4 host and controller software is enabling EM Microelectronic’s flagship em | bleu (EM9305). The em | bleu single chip is a small form factor and ultra-low energy consuming Bluetooth LE SoC or companion IC solution supporting the very latest Bluetooth technology including PAwR, LE Audio and Auracast broadcast audio.