All items tagged with product development and audio development (16)

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

December 3, 2024 by Joao Martins

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

As a leading engineering house for audio development, supplying software and hardware solutions for connected audio products, StreamUnlimited relies on a series of development modules that respond to all major application areas and form-factors. The company now reengineered its hardware modules to ensure extended longevity and that modules remain compatible with advancing technologies, enabling manufacturers to extend product lifecycles and provide greater value to end-users.

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

Peerless and Dirac Announce Strategic Partnership for Room Correction Integration

October 23, 2024 by Joao Martins

Peerless and Dirac Announce Strategic Partnership for Room Correction Integration

Peerless, a Tymphany subsidiary, and Dirac, the Swedish digital audio processing specialists, announced a strategic partnership to improve sound reproduction across the home and professional audio markets. The partnership integrates Dirac’s Dirac Live solution into Peerless’ Flow DSP audio development platform to enable manufacturers of home audio and professional audio systems to more seamlessly and efficiently integrate premium room correction into their product portfolio.

CUI Devices Launches New Audio Design Services

February 27, 2024 by audioXpress Staff

CUI Devices Launches New Audio Design Services

Oregon-based CUI Devices’ Audio Group announced the official launch of its new audio design services, with a team of sound specialists that are able to leverage advanced simulation tools and testing as well as decades of expertise to support developers and brands. Even for companies with their own in-house resources this level of support is able to optimize a range of audio parameters to specific system needs.

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

Bluetooth LE Audio Development for Smart Hearables Seminar

September 6, 2023 by audioXpress Staff

Bluetooth LE Audio Development for Smart Hearables Seminar

With the availability of the first platforms and sources, the window for Product Developers to leverage the potential of Bluetooth LE Audio products and create a strong impact at launch is now getting smaller. Learn how to bring LE Audio products to market now. Evolve Bluetooth Classic radio products and design for Bluetooth Low Energy (LE) radio. The Bluetooth LE Audio Development for Smart Hearables seminar is planned to take place in Q2 2024 at the Sonesta Silicon Valley, CA.

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

December 21, 2022 by audioXpress Staff

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

Femtosense announced the arrival and successful testing of its first silicon, substantiating the startup’s assertions that it will deliver significantly more efficient, lower cost and real-time AI processing for valuable and affordable consumer electronics. At CES 2023, the Edge AI company will demonstrate compelling audio applications with highly efficient, real-time artificial intelligence (AI) processing with low power, low cost requirements.

Simplify Engineering - Building a Collaboration Platform for System Engineers That Specialize in R&D and Manufacturing

December 8, 2022 by Joshua Levy

Simplify Engineering - Building a Collaboration Platform for System Engineers That Specialize in R&D and Manufacturing

I'm a hardware engineer with over ten years of experience, based in Southern California. I've worked on products like the Amazon Alexa and Meta Oculus, and I have grown frustrated with the current processes and inefficiencies of the consumer electronics industry. This is why I created The Lyceum, an online collaborative software that facilitates hardware system engineering research & development and manufacturing by automating data-intensive tasks, keeping a track record of historical technical data, and offering tools for online group work.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

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