All items tagged with product development and Qualcomm (45)

The Future of Seamless Audio According to Qualcomm

March 20, 2025 by Joao Martins

The Future of Seamless Audio According to Qualcomm

An exclusive interview with Dino Bekis, Qualcomm's Vice President and General Manager, Wearables & Mixed Signal Solutions Business Unit, where he shares fascinating insights into the company's roadmap and future developments, leveraging the best of Bluetooth and Wi-Fi in wireless earbuds and headphones into a seamless, high-quality audio experience. We also learn about Qualcomm's unique vision for its latest generation Snapdragon Sound platforms, and XPAN technology, allowing wireless hi-res audio without bandwidth constraints or compromising battery life.

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.

Noble Unveils Five-Driver TWS Design With ANC and Personalization by Audiodo

November 26, 2024 by Joao Martins

Noble Unveils Five-Driver TWS Design With ANC and Personalization by Audiodo

Not a company that shies away from pushing the envelope on personal audio, Noble Audio just announced a world's first true wireless stereo design using five drivers - 1 dynamic, 1 planar, and 3 balanced armatures. Not an easy feat given that a true wireless relies only on a tiny battery. But the FoKus Rex5 earbuds also support Active Noise Cancelling and even features sound personalization, developed in collaboration with Audiodo.

Bluetooth Wireless Audio, Innovations in Audio, and More in audioXpress December 2024

November 12, 2024 by audioXpress Staff

Bluetooth Wireless Audio, Innovations in Audio, and More in audioXpress December 2024

audioXpress December 2024 features a comprehensive report on Bluetooth LE Audio and Auracast, the suppliers and development ecosystem. Jonny McClintock adds insights on Ultra-Low Latency Audio Transmission over Bluetooth LE Audio. Plus three reviews of the QuantAsylum QA403 Audio Analyzer, the DPS-2 Power Supply and LNI-2 DC Filter and Stabilizer from RME Audio, and the SPL Phonitor 3 DAC, Headphone Amplifier and Monitor Controller. Hans Polak details his extensive experiments on Moving Magnet Cartridges.

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

IOT747 Releases Low 20ms Latency Mode for IDC777 Module

October 22, 2024 by Joao Martins

IOT747 Releases Low 20ms Latency Mode for IDC777 Module

IOT747 announced a new low latency feature for its IDC777 ultra-low power module. The IDC777 is a fully integrated dual mode LE Audio (LC3 Codec Auracast and Unicast) and Classic Bluetooth module, optimized for Bluetooth wireless audio designs. With this new 20ms low latency stereo mode, the IDC777 module supports even further flexibility for device customization, enabling applications for gaming and an improved experience for Auracast audio sharing and broadcasting.

Managing Expectations: The Bluetooth LE Audio Calendar

August 8, 2024 by Joao Martins

Managing Expectations: The Bluetooth LE Audio Calendar

Fear of Missing Out on Bluetooth LE Audio? Are We There Yet? How many more days? When should you trigger that OTA firmware update? Should you ship Auracast-enabled products now? Should you be the first? No one wants to be the first.

xMEMS Labs Debuts Reference Designs for True Wireless Stereo Earbuds and In-Ear-Monitors

June 4, 2024 by Joao Martins

xMEMS Labs Debuts Reference Designs for True Wireless Stereo Earbuds and In-Ear-Monitors

Intended to accelerate the adoption of its MEMS microspeakers in true wireless earbuds and in-ear monitors, xMEMS Labs announced the availability of two innovative reference designs available for purchase directly at the xMEMS web store. These reference designs, featuring production-ready MEMS drivers, allow developers to get familiarized with the implementation and performance of xMEMS products, setting brands or manufacturers on a clear and accelerated path to market.

Qualcomm Unveils S7 Pro Snapdragon Sound Platform With Micro-Power Wi-Fi and 24-bit/192kHz Lossless Streaming

October 24, 2023 by Joao Martins

Qualcomm Unveils S7 Pro Snapdragon Sound Platform With Micro-Power Wi-Fi and 24-bit/192kHz Lossless Streaming

During its Snapdragon Summit event Qualcomm unveiled the latest S7 and S7 Pro Gen1 Sound platforms, which will soon power a new generation of advanced audio products. The new platforms offer five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to the previous generation. A real differentiator is the use of micro-power Wi-Fi to extend wireless audio range and support for up to 192kHz lossless music quality in the S7 Pro.

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

June 21, 2023 by audioXpress Staff

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

Qualcomm Technologies International unveiled an addition to the Qualcomm S3 Gen 2 Sound platform portfolio. This newly enhanced solution is optimized for gaming and ready for use in dongles and adapters. It combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced.

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