All items tagged with connected devices (137)

CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect Devices to the Alibaba Cloud

June 25, 2019 by audioXpress Staff

CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect Devices to the Alibaba Cloud

Signal processing platform specialist CEVA introduced a fully-integrated, licensable Wi-Fi solution for companies looking to accelerate the development of connected devices that make use of Alibaba Cloud. The turnkey solution integrates CEVA’s industry-leading RivieraWaves Wi-Fi Low Power IP together with the AliOS Things operating system on a single RISC-V CPU core, providing the freedom to focus development efforts on creating differentiation in the end application.

LEA Professional Launches New Technology Platform and First Low Power, Connected Amplifiers

June 13, 2019 by audioXpress Staff

LEA Professional Launches New Technology Platform and First Low Power, Connected Amplifiers

As highly anticipated, LEA Professional was the focus of attention as soon as InfoComm 2019 opened its doors in Orlando, introducing its professional-grade IoT (Internet of Things) technology platform with the launch of the LEA Connect Series amplifier family. As promised, LEA wants to bring the benefits of a connected world to the Professional A/V market, allowing system designers and integrators to provide real-time system performance coverage to their existing service contacts.

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

May 31, 2019 by Cristina Costa

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

Lattice Semiconductor announced the availability of the HM01B0 UPduino Shield, a comprehensive development kit for implementing Artificial Intelligence (AI) computing in devices using vision and sound as sensory inputs. This rapid prototyping board, in the Arduino form factor, includes components designers need to quickly develop always-on, low power smart IoT and connected devices. This new development kit consists of a Lattice iCE40 UltraPlus FPGA-based Upduino 2.0 board and a Himax HM01B0 image sensor module.

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.

Step-Down Converters from STMicroelectronics Save Energy and Space in Connected and Wearable Devices

March 14, 2019 by Cristina Costa

Step-Down Converters from STMicroelectronics Save Energy and Space in Connected and Wearable Devices

STMicroelectronics has announced its ST1PS01 step-down converters. The devices are engineered for small size, low quiescent current and high efficiency at all values of load current, to save energy and real-estate in keep-alive connected devices such as asset trackers, wearables, smart sensors and smart meters. Leveraging synchronous rectification, efficiency is 92% at 400 mA full load and 95% when delivering just 1 mA.

NTi Audio Announces Smart Measurements for Smart Devices Using the Flexus FX100 Audio Analyzer

December 18, 2018 by audioXpress Staff

NTi Audio Announces Smart Measurements for Smart Devices Using the Flexus FX100 Audio Analyzer

Responding to the challenges that were brought to the audio industry by the sweeping popularity of connected speakers and smart home devices, Swiss test and measurement specialist NTi Audio just announced an open loop test solution for its FX100 Audio Analyzer system and produced a tutorial using an Amazon Echo Dot device to demonstrate how to test the device's loudspeaker and microphone array using an open loop configuration test sequence.

SAR Insight & Consulting Estimates 335 Million Voice Assistant Smart Devices in Use in China by 2023

December 17, 2018 by audioXpress Staff

SAR Insight & Consulting Estimates 335 Million Voice Assistant Smart Devices in Use in China by 2023

Smart devices have proliferated across everyday life for Chinese people, offering considerable opportunities for global companies operating within the AI space – specifically focused on the voice assistant market. According to the latest report from SAR Insight & Consulting – China Voice Market – the average Chinese consumer has become much more positive about the benefits of owning connected devices helping to drive greater interest in the interactive voice functionality.

MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond

December 12, 2018 by audioXpress Staff

MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today released MIPI I3C Basic v1.0, a subset of the MIPI I3C specification that bundles the most commonly needed I3C features for developers and other standards organizations. Released under royalty-free terms, MIPI I3C Basic provides a streamlined upgrade path from the ubiquitous I2C, with the most commonly needed developer capabilities for smartphones, IoT devices, connected vehicles and more.

Intel Unveils the Intel Neural Compute Stick 2 for Building Smarter AI Edge Devices

November 19, 2018 by audioXpress Staff

Intel Unveils the Intel Neural Compute Stick 2 for Building Smarter AI Edge Devices

For developers working on industrial robots, drones and all sorts of connected or smart home devices, the new Intel Neural Compute Stick (NCS) 2 offers what's needed to prototype faster and smarter, runs on a standard USB 3.0 port and requires no additional hardware. The NCS 2 was introduced at Intel's first artificial intelligence (AI) developer conference in Beijing (Nov. 14-15, 2018), an event were the company promoted its vision for building smarter AI algorithms and intelligent devices at the network edge.

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

November 16, 2018 by Cristina Costa

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

Renesas Electronics unveiled an innovative energy-harvesting embedded controller that can eliminate the need to use or replace batteries in connected devices. Developed based on Renesas' breakthrough SOTB (silicon-on-thin-buried-oxide) process technology, the new embedded controller achieves extreme reduction in both active and standby current consumption, a combination that was not previously possible to achieve in conventional microcontrollers (MCUs).

«
1
2
...
5
6
7
8
9
10
11
12
13
14
»