All items tagged with connected devices (129)

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

SEGGER embOS RTOS Transforms 64-bit SoCs Into Single Chip Computers

December 4, 2020 by audioXpress Staff

SEGGER embOS RTOS Transforms 64-bit SoCs Into Single Chip Computers

German company SEGGER Microcontroller continues to expand its state-of-the-art software libraries and hardware and software tools for embedded systems development and production. In an interesting development, SEGGER has announced that its embOS real-time operating system now supports 64-bit processor cores. And many developers would also be interested to know that the company's SystemView verification solution for embedded development is now available under Friendly Licensing.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

STMicroelectronics and DSP Concepts Deliver All-In-One Amazon-Qualified Far-Field Voice Reference Design

November 18, 2020 by audioXpress Staff

STMicroelectronics and DSP Concepts Deliver All-In-One Amazon-Qualified Far-Field Voice Reference Design

STMicroelectronics has released an Amazon-qualified reference design package for smart connected devices leveraging Amazon AVS voice integration, which can be used to create Alexa Built-in products using simple microcontrollers (MCUs). The new reference design eases development of natural-language understanding and voice-based user interaction for smart-home devices and smart appliances, featuring an improved audio front end created with DSP Concepts for far-field audio detection.

Klippel Analyzer System Receives Software Updates for Testing DSP-Based Audio Devices

November 17, 2020 by Joao Martins

Klippel Analyzer System Receives Software Updates for Testing DSP-Based Audio Devices

Klippel has been keeping busy in the last months, continuously improving their measurement technology for loudspeakers and audio systems. With the dB-Lab 210.918 and QC 6.7 software updates, Klippel introduced new tools for testing DSP-enhanced speakers, headphones and connected audio systems, first with and hardware add-on for the SCN Scanning Vibrometer, and second with an extension for automatic testing at multiple excitation levels using the TRF module.

Imagimob Edge Makes TensorFlow AI Models Edge Device-Ready at the Click of a Button

October 19, 2020 by audioXpress Staff

Imagimob Edge Makes TensorFlow AI Models Edge Device-Ready at the Click of a Button

Imagimob, a company based in Stockholm, Sweden, developing artificial intelligence products for edge devices, announced a new SaaS solution that accelerates time to market for edge devices by converting h5 formatted AI models into ultra-efficient C-code in a matter of seconds — a process that once took weeks to complete. The new Imagimob Edge solution requires no programming skills and targets processing and interpreting sensor data in real time using trained models, a critical application in wearables and all sorts of connected devices.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

CEVA RivieraWaves Wi-Fi 6 Solution Achieves Wi-Fi Certified 6 Status from the Wi-Fi Alliance

August 20, 2020 by audioXpress Staff

CEVA RivieraWaves Wi-Fi 6 Solution Achieves Wi-Fi Certified 6 Status from the Wi-Fi Alliance

CEVA announced that its RivieraWaves Wi-Fi 6 IP platform has become the world’s first Wi-Fi IP to achieve Wi-Fi Certified 6 Status from the Wi-Fi Alliance. CEVA offers a complete suite of Wi-Fi 6 IPs, spanning 1x1 20 MHz for low power connected devices through to MIMO 80/160MHz Wi-Fi 6 and 6E for higher end products including smartphones, smart TVs, access points and wireless infrastructure. CEVA’s RivieraWaves 802.11ax MAC & modem IP have already been licensed to multiple semiconductor companies and OEMs for upcoming Wi-Fi 6 products.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

August 6, 2020 by Cristina Costa

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

Renesas Electronics announced sample shipment availability of the new RYZ012 Bluetooth module targeting ultra-low power applications in connected devices. The RYZ012 is Renesas' first Bluetooth Low Energy 5 module. It integrates a 2.4 GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol, Bluetooth Low Energy (LE), Bluetooth LE Mesh, and ZigBee. The RYZ012 features a power draw of only 0.4µA during deep sleep (without SRAM retention) allowing developers to extend battery life.

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