All items tagged with Bluetooth 5.2 (87)

CEVA Receives Bluetooth SIG Qualification for RivieraWaves Bluetooth Dual Mode 5.2 Platform

May 6, 2021 by audioXpress Staff

CEVA Receives Bluetooth SIG Qualification for RivieraWaves Bluetooth Dual Mode 5.2 Platform

CEVA announced that its RivieraWaves Bluetooth Dual Mode 5.2 Platform has achieved Bluetooth SIG Qualification. Supporting both the widely adopted Bluetooth Classic Audio and the latest features for the next generation Bluetooth LE Audio, licensees can use the RivieraWaves Bluetooth Dual Mode 5.2 Platform to leap ahead with their next-generation designs for TWS earbuds, smart watches, smart speakers and other Bluetooth-enabled audio products.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

March 25, 2021 by audioXpress Staff

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

Ellisys released a broad complement of innovative features to support development of emerging Bluetooth LE Audio products, including controllers, stacks, and devices. These features, available on the company's Bluetooth protocol analysis systems, broaden support for the latest Bluetooth LE Audio specifications and deliver unique technical innovations that solve complex issues for developers.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

December 16, 2020 by audioXpress Staff

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

Qualcomm Technologies International, unveiled the Qualcomm QCC305x SoCs, designed specifically to help brands differentiate across a range of tiers in the very fast-moving truly wireless earbud category. The new SoCs are designed to meet demand for advanced wireless audio use cases, and enable end-to-end support for the new Bluetooth LE Audio standard. The QCC305x series also adds support for ultra-low-power digital ANC technology, Qualcomm Adaptive ANC, Qualcomm TrueWireless Mirroring, and wake word activated voice assistants.

EarFun Sets Record for Lightest ANC Wireless Earbuds with New EarFun Free Pro

December 7, 2020 by Joao Martins

EarFun Sets Record for Lightest ANC Wireless Earbuds with New EarFun Free Pro

EarFun is one of those consumer brands, established in 2018 by an experienced group of industrial designers and acoustic engineers, focused on next-generation wireless audio devices and leveraging their manufacturing network in Shenzhen, China. Committed to deliver solutions that use the latest technology and improve sound quality, the EarFun engineering team has been pushing the envelope on how affordable and sophisticated true wireless earbuds can be. With the new EarFun Free Pro, the brand seems to have come full circle.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

December 3, 2020 by Joao Martins

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

During the annual Snapdragon Tech Summit Digital 2020, Qualcomm introduced its latest flagship Qualcomm Snapdragon 888 5G Mobile Platform, which will set the benchmark for flagship Android smartphones in 2021. This new platform packs industry-leading mobile innovations in 5G, artificial intelligence (AI), gaming, and camera technologies, while offering all the processing and connectivity power to enable next-generation immersive audio experiences, including support for Bluetooth 5.2 with LE Audio features.

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

November 23, 2020 by audioXpress Staff

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

CEVA announced that its RivieraWaves Bluetooth Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification. As the first IP company to receive Bluetooth LE 5.2 qualification, CEVA enables its licensees to reduce their product development risk and so benefit with expedited time-to-market and end-product qualification process. Since September 2020, the Bluetooth Special Interest Group (SIG) started qualifying products using the new LE Audio Specification, announced in January 2020.

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

September 24, 2020 by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.

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