All items tagged with Bluetooth 5.2 (87)
Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products
June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.
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Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2
May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.
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Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting
March 19, 2020 by audioXpress Staff

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

Cinemas, gamers and the hard of hearing could all benefit from Bluetooth 5.2, according to the latest "Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast" report from SAR Insight & Consulting. Bluetooth will continue to be a popular and flexible way to connect devices, thanks in part to the technology being refreshed to remain relevant to component manufacturers and consumers, says SAR Insight & Consulting.
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Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2
February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.
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Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio
January 14, 2020 by audioXpress Staff

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Tempow, the company that specializes in software-only solutions to enhance the core Bluetooth protocol, announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. The company also announced a partnership program for chipset manufacturers to use Tempow’s implementation. Telink Semiconductor was the first to join the program.
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CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio
January 8, 2020 by audioXpress Staff

CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio

CEVA, the wireless connectivity specialist, announced that it has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices with the general release of the RivieraWaves Bluetooth Low Energy and Dual Mode IPs with support for LE Audio, the next generation of Bluetooth audio. The CEVA solution introduces new features that enhance audio quality and link robustness as well as enabling new audio sharing use cases.
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Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio
January 7, 2020 by audioXpress Staff

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.
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