All items tagged with beamforming (91)

XMOS Powers Growth in Voice with $15M Funding Round Led by Infineon Technologies

September 27, 2017 by audioXpress Staff

XMOS Powers Growth in Voice with $15M Funding Round Led by Infineon Technologies

XMOS Ltd, a leading vendor in voice capture solutions for the OEM consumer electronics market, has successfully complete a $15M Series-E funding round. The round was led by Infineon Technologies with additional funding from existing investors Amadeus Capital Partners, Draper Esprit, Foundation Capital and Robert Bosch Venture Capital. Following previous platform cooperations, Infineon Technologies AG acquired a minority stake in the company, strengthening the strategic partnership.

MEMS Microphones - Vesper Delivers New MEMS Microphone Technology

August 1, 2017 by Mike Klasco

MEMS Microphones - Vesper Delivers New MEMS Microphone Technology

Since 2009, Vesper has built a broad and deep patent portfolio around its proprietary MEMS piezoelectric technology, which works quite differently from conventional capacitive MEMS microphones. As Matt Crowley, CEO of Vesper, says during an interview with Voice Coil, “We are just beginning to realize the potential of piezoelectric MEMS microphones.” This article was originally published in Voice Coil, December 2016.

iFlyTek On-Device Speech Recognition Software Now Available For CEVA's Ultra-Low Power Audio/Voice DSPs

July 3, 2017 by audioXpress Staff

iFlyTek On-Device Speech Recognition Software Now Available For CEVA's Ultra-Low Power Audio/Voice DSPs

CEVA, a leading provider of signal processing solutions for smart, connected devices, announced that an optimized implementation of iFLYTEK's speech-recognition software suite is available for CEVA's audio/voice DSPs. The tightly-integrated solution is now available for developers, and the company confirmed it will start production of an ultra-low power voice processor targeting high-volume consumer electronics.

Nureva Announces Availability of its HDL300 Audio Conferencing System

June 13, 2017 by audioXpress Staff

Nureva Announces Availability of its HDL300 Audio Conferencing System

Nureva announced general availability of its highly anticipated HDL300 audio conferencing system, featuring the company's Microphone Mist technology. Following a presentation a year ago, the company will launch the new integrated microphone and speaker bar for huddle rooms at InfoComm 2017. The Canadian company is also announcing a North American dealer recruitment initiative for its HDL300 system, creating opportunities for resellers.

Apple Updates All Hardware and Software at WWDC17 and Announces HomePod Speaker

June 6, 2017 by Joao Martins

Apple Updates All Hardware and Software at WWDC17 and Announces HomePod Speaker

Apple's opening keynote for its Worldwide Developers Conference 2017 (WWDC17) at the San Jose McEnery Convention Center, was a swirl of long expected announcements, wrapped in surprising underlying technology revelations. Among the many announcements was the preview of Apple's new home music speaker with built-in-far-field voice recognition powered by Apple Siri, the HomePod. As expected, the design is a powerful combination of electroacoustic mastery, digital processing and smart connectivity.

miniDSP Introduces UMA-8 USB Microphone Array for Voice-Activated Applications

May 18, 2017 by audioXpress Staff

miniDSP Introduces UMA-8 USB Microphone Array for Voice-Activated Applications

The new miniDSP UMA-8 is a high-performance yet low cost multichannel USB microphone array built around XMOS multicore technology, designed for voice-recognition application development. Seven high-performance MEMS microphones are configured in a circular arrangement to provide high-quality voice capture for a wide range of applications. Leveraging the onboard DSP processing, the UMA-8 supports voice algorithms including beamforming, noise reduction, acoustic echo cancellation and de-reverb.

3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements

April 11, 2017 by audioXpress Staff

3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements

3PASS flex is HEAD acoustics new simulation system for measuring speech quality performance in the presence of background noise. It is particularly suited for testing multi-microphone systems, microphone arrays or beamforming microphones in real world conditions where multi-point noise simulation with flexible microphone and loudspeaker arrays is required. 3PASS flex reproduces any previously recorded sound field at distinct microphone positions, representative of typical use cases.

Yamaha Debuts CS-700 Video Sound Collaboration System for Huddle Rooms

March 29, 2017 by audioXpress Staff

Yamaha Debuts CS-700 Video Sound Collaboration System for Huddle Rooms

Yamaha has announced the CS-700, an all-in-one collaboration solution specifically designed to support small meeting room environments, which don't benefit from the same careful acoustics and technology existing in traditional conference facilities. The CS-700 combines best-in-class audio with high-quality video to fulfill huddle room requirements and collaboration capabilities in one simple, wall-mounted system.

Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

March 2, 2017 by audioXpress Staff

Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

At Mobile World Congress 2017, Barcelona, Infineon Technologies and XMOS partner to deliver a new building block for voice recognition. It features a combination of Infineon’s BGT60TR24B 60GHz 2Tx/4Rx radar IC with accompanying antenna, 70dB SNR silicon microphone sensors, based on Infineon’s dual backplate MEMS technology, and an audio processor from XMOS. In combination, the solution provides far field voice capture by audio beamforming combined with radar target presence detection.

Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for Microphone Far-Field Voice Pickup Applications

January 3, 2017 by audioXpress Staff

Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for Microphone Far-Field Voice Pickup Applications

CEVA DSP, a licensor of signal processing IP for smarter, connected devices, announced that Shenzhen Micro & Nano Institute (MNI) has licensed the CEVA audio/voice DSP for the development of a multi-mic voice processor targeting a range of intelligent hardware systems including robots, smart appliances and the smart home. CEVA DSP's will power MNI’s 360 degree voice positioning algorithm in their intelligent voice processor.

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