All items tagged with beamforming (93)

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

November 5, 2019 by audioXpress Staff

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

No more yelling at smart speakers. Texas Instruments (TI) introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The new TI Burr-Brown TLV320ADC5140 audio ADC enables far-field voice capture and achieves a 120-dB dynamic range for clear, high-fidelity audio in smart home applications. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance.

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

Sennheiser Enters Automotive Sector Showing First In-Car AMBEO Sound System at Monterey Car Week

August 7, 2019 by audioXpress Staff

Sennheiser Enters Automotive Sector Showing First In-Car AMBEO Sound System at Monterey Car Week

Sennheiser developed an AMBEO immersive audio solution for in-car entertainment and communication in collaboration with Southern California-based luxury automaker, Karma Automotive. Engineered using highest-grade microphone and loudspeaker technology and 3D audio expertise, the AMBEO sound system provides impressively enveloping sound and clear audio for phone calls. The system can first be experienced as a technology showcase on a new 2020 Karma Revero GT during Monterey Car Week (August 15-18).

Sennheiser Improves the Meeting Experience at InfoComm 2019

June 10, 2019 by audioXpress Staff

Sennheiser Improves the Meeting Experience at InfoComm 2019

At InfoComm 2019 (June 12-14), Sennheiser will highlight its business and education solutions portfolio, with a focus on its new TeamConnect Ceiling 2 (TCC2) microphone array. Sennheiser will offer live booth demonstrations of TeamConnect Ceiling 2, which uses its patented automatic, dynamic beamforming technology to deliver the ultimate virtual meeting experience. They will also be demonstrating the latest version of its Sennheiser Control Cockpit software at Infocomm 2019.

Dusun Electron Announces Far-Field Voice Control Solution

June 7, 2019 by audioXpress Staff

Dusun Electron Announces Far-Field Voice Control Solution

Dusun Electron demonstrated its far-field voice control solution at CES 2019 in Las Vegas, and the company now confirmed its availability. This new voice control solution enables voice-activated devices to clearly capture voice commands from a distance or even in noisy environments for a hands-free interactive experience. The Dusun platform features multi-microphone interfaces, an ARM-based processor, and supports voice front-end processing algorithms such as AEC, AGC, NR, beamforming, etc.

Holoplot Promotes Immersive Audio and Large Sound Fields at Prolight+Sound 2019

April 18, 2019 by audioXpress Staff

Holoplot Promotes Immersive Audio and Large Sound Fields at Prolight+Sound 2019

German audio technology pioneer Holoplot reported another successful demonstration of wave field synthesis technology at the Prolight+Sound 2019 show, with examples of its groundbreaking "more than beamforming" conferencing and retail-oriented ORION Series solution. Along with extensive showcases of its current products, the company was an enthusiastic participant in the event's education program, with Head of Applications Emad El-Saghir giving two well-received presentations.

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.

QuickLogic Announces Time Series EOS S3AI Development Platform for Endpoint AI and Machine Learning Applications

March 18, 2019 by audioXpress Staff

QuickLogic Announces Time Series EOS S3AI Development Platform for Endpoint AI and Machine Learning Applications

QuickLogic, the developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its EOS S3AI platform for endpoint Artificial Intelligence (AI) and Machine Learning (ML) applications. The new AI platform provides all the hardware blocks needed to enable low power AI at the connected device endpoint. It comes with time-series (continuous) sensors, including accelerometer / gyroscope / magnetometer motion sensors and two digital microphones (PDMs).

Listen Offers ETSI Standard Background Noise Generation System

February 22, 2019 by audioXpress Staff

Listen Offers ETSI Standard Background Noise Generation System

Listen has launched the ETSI standard background noise generation module, a SoundCheck test sequence which calibrates a 4.1 speaker array to conform with the ETSI ES 202 396-1 Standard. This provides an equalized, calibrated playback solution to stress devices in a standardized and repeatable way. With a purchase price of just $5,000 for the test sequence, this offers an extremely economical alternative to a conventional $20,000+ stand-alone background noise generation system.

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