All items tagged with beamforming (91)

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

Sennheiser Enters Automotive Sector Showing First In-Car AMBEO Sound System at Monterey Car Week

August 7, 2019 by audioXpress Staff

Sennheiser Enters Automotive Sector Showing First In-Car AMBEO Sound System at Monterey Car Week

Sennheiser developed an AMBEO immersive audio solution for in-car entertainment and communication in collaboration with Southern California-based luxury automaker, Karma Automotive. Engineered using highest-grade microphone and loudspeaker technology and 3D audio expertise, the AMBEO sound system provides impressively enveloping sound and clear audio for phone calls. The system can first be experienced as a technology showcase on a new 2020 Karma Revero GT during Monterey Car Week (August 15-18).

Sennheiser Improves the Meeting Experience at InfoComm 2019

June 10, 2019 by audioXpress Staff

Sennheiser Improves the Meeting Experience at InfoComm 2019

At InfoComm 2019 (June 12-14), Sennheiser will highlight its business and education solutions portfolio, with a focus on its new TeamConnect Ceiling 2 (TCC2) microphone array. Sennheiser will offer live booth demonstrations of TeamConnect Ceiling 2, which uses its patented automatic, dynamic beamforming technology to deliver the ultimate virtual meeting experience. They will also be demonstrating the latest version of its Sennheiser Control Cockpit software at Infocomm 2019.

Dusun Electron Announces Far-Field Voice Control Solution

June 7, 2019 by audioXpress Staff

Dusun Electron Announces Far-Field Voice Control Solution

Dusun Electron demonstrated its far-field voice control solution at CES 2019 in Las Vegas, and the company now confirmed its availability. This new voice control solution enables voice-activated devices to clearly capture voice commands from a distance or even in noisy environments for a hands-free interactive experience. The Dusun platform features multi-microphone interfaces, an ARM-based processor, and supports voice front-end processing algorithms such as AEC, AGC, NR, beamforming, etc.

Holoplot Promotes Immersive Audio and Large Sound Fields at Prolight+Sound 2019

April 18, 2019 by audioXpress Staff

Holoplot Promotes Immersive Audio and Large Sound Fields at Prolight+Sound 2019

German audio technology pioneer Holoplot reported another successful demonstration of wave field synthesis technology at the Prolight+Sound 2019 show, with examples of its groundbreaking "more than beamforming" conferencing and retail-oriented ORION Series solution. Along with extensive showcases of its current products, the company was an enthusiastic participant in the event's education program, with Head of Applications Emad El-Saghir giving two well-received presentations.

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.

QuickLogic Announces Time Series EOS S3AI Development Platform for Endpoint AI and Machine Learning Applications

March 18, 2019 by audioXpress Staff

QuickLogic Announces Time Series EOS S3AI Development Platform for Endpoint AI and Machine Learning Applications

QuickLogic, the developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its EOS S3AI platform for endpoint Artificial Intelligence (AI) and Machine Learning (ML) applications. The new AI platform provides all the hardware blocks needed to enable low power AI at the connected device endpoint. It comes with time-series (continuous) sensors, including accelerometer / gyroscope / magnetometer motion sensors and two digital microphones (PDMs).

Listen Offers ETSI Standard Background Noise Generation System

February 22, 2019 by audioXpress Staff

Listen Offers ETSI Standard Background Noise Generation System

Listen has launched the ETSI standard background noise generation module, a SoundCheck test sequence which calibrates a 4.1 speaker array to conform with the ETSI ES 202 396-1 Standard. This provides an equalized, calibrated playback solution to stress devices in a standardized and repeatable way. With a purchase price of just $5,000 for the test sequence, this offers an extremely economical alternative to a conventional $20,000+ stand-alone background noise generation system.

CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture

January 4, 2019 by audioXpress Staff

CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture

CEVA announced its new all-purpose, hybrid DSP / Controller architecture to address new algorithms of digital signal processing in voice, video, communication, sensing and digital signal control applications. Offering general purpose DSP capabilities required for motor control and electrification, the new CEVA-BX architecture extends CEVA's market reach into the burgeoning automotive and industrial markets currently underserved by legacy DSPs or MPU/MCUs with low performance DSP co-processing.

beyerdynamic Debuts Phonum Wireless Bluetooth and USB Speakerphone at CES 2019

January 3, 2019 by audioXpress Staff

beyerdynamic Debuts Phonum Wireless Bluetooth and USB Speakerphone at CES 2019

Following an earlier presentation of the concept in 2018, beyerdynamic will use CES 2019 to officially launch Phonum, its wireless Bluetooth and USB speakerphone with high-quality sound transmission and integrated premium loudspeaker that radiates 360-degrees of sound. While Phonum was designed for corporate applications and meeting spaces, beyerdynamic’s clearly thinks the concept will be attractive and simply to use that it should also get attention in the generic consumer electronics space. It's time for the "smart speakerphone."

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