Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

At Mobile World Congress 2017, Barcelona, Infineon Technologies and XMOS partner to deliver a new building block for voice recognition. It features a combination of Infineon’s BGT60TR24B 60GHz 2Tx/4Rx radar IC with accompanying antenna, 70dB SNR silicon microphone sensors, based on Infineon’s dual backplate MEMS technology, and an audio processor from XMOS. In combination, the solution provides far field voice capture by audio beamforming combined with radar target presence detection.

CEVA DSP, a licensor of signal processing IP for smarter, connected devices, announced that Shenzhen Micro & Nano Institute (MNI) has licensed the CEVA audio/voice DSP for the development of a multi-mic voice processor targeting a range of intelligent hardware systems including robots, smart appliances and the smart home. CEVA DSP's will power MNI’s 360 degree voice positioning algorithm in their intelligent voice processor.

The second Audio Engineering Society (AES) International Conference on Sound Field Control, will be held at the University of Surrey, Guildford, UK, an important center for research and teaching in audio, video, and communications engineering. This conference will gather researchers, engineers and users to explore and discuss arrays, algorithms, abstractions and applications for sound field control, an area with increasingly exciting application areas.