All items in category Industry News
Audio Engineering Society Europe 2023 Convention, Helsinki, May 13 – 15
by Audio Engineering_Society

Audio Engineering Society Europe 2023 Convention, Helsinki, May 13 – 15

The Audio Engineering Society Europe 2023 Convention is set to take place at Aalto University, Espoo, Helsinki, Finland, May 13 – 15. This 75th AES anniversary year convention gathers top names and technologies from around the world for three days of presentations and events aimed at strengthening attendees’ audio knowledge and presence in the industry. AES Europe 2023 will bring together leaders in audio research, technology and education for three days of audio immersion, featuring over 140 workshops, paper presentations, and sessions.
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MPEG-H Decoder Implementation Now Available for Cirrus Logic DSPs
by Joao Martins

MPEG-H Decoder Implementation Now Available for Cirrus Logic DSPs

RT-RK, a leading embedded software development house, alongside Fraunhofer IIS, the primary developer of the MPEG-H Audio standard, announced the immediate availability of RT-RK's MPEG-H 3D Audio decoder implementation for Cirrus Logic DSPs commonly used in home theater products such as AV Receivers and Soundbars. The successful implementation will further accelerate the development of new products based on these low-cost embedded Cirrus Logic platforms.
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Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers
by audioXpress Staff

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

Swedish digital audio processing pioneer Dirac and leading multinational chipset maker BES announced a partnership to pre-integrate the Dirac Virtuo and Dirac Opteo software onto BES chipsets to be used by leading headphone manufacturers to deliver optimized performance in any headphone type. The announcement was made at CES 2023, where it was confirmed that boAt, Monoprice, and Sudio are the first headphone brands to leverage these Dirac-enabled BES chipsets in their devices.
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Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology
by audioXpress Staff

Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

Infineon Technologies recently introduced its latest generation of MERUS multilevel Class-D audio amplifiers, and now the company announced new ecosystem partners that are ready to support interested developers and manufacturers with their design-in efforts. Partnering with the experts, the company aims to boost the adoption of these new amplifiers with a unique Class D modulation of up to 5 different output voltage levels.
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The Audio Engineering Society Welcomes Bruce Olson as President
by Audio Engineering_Society

The Audio Engineering Society Welcomes Bruce Olson as President

The AES welcomed Bruce Olson as President for 2023, the Society’s 75th anniversary year. Olson, whose term of service began on January 1, is an AES Fellow whose decades of active service to the Society have helped shape international audio standards and practices, while he has further contributed to the Society as a Governor and Chair, Treasurer, and committee member of his local AES section.
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xMEMS Announces Montara Plus 2nd Generation High-Sensitivity Solid-State MEMS Drivers for Hi-Res Audiophile-Grade IEMs
by Joao Martins

xMEMS Announces Montara Plus 2nd Generation High-Sensitivity Solid-State MEMS Drivers for Hi-Res Audiophile-Grade IEMs

xMEMS Labs introduced Montara Plus, its 2nd generation high-res full-range (20Hz to 40KHz) monolithic MEMS micro speaker. At just 64mm3, Montara Plus delivers 120dB SPL at 1kHz. Matching the new Montara Plus, targeting the high end market, xMEMS announced a partnership with iFi Audio and Singularity Audio, which will be launch partners for DAC/amp and IEMs respectively.
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Harman Unveiled Innovative Automotive Audio Solutions to Bolster In-Vehicle Experience and Safety
by Joao Martins

Harman Unveiled Innovative Automotive Audio Solutions to Bolster In-Vehicle Experience and Safety

As the "automotive technology company and subsidiary of Samsung Electronics," Harman was one of the busiest companies at CES 2023. Among the many automotive systems, Harman announced its new Sound and Vibration Sensor and External Microphone products to enhance the audio experience inside and outside the vehicle. It also launched Harman Ready on Demand, a software platform and marketplace that allows users to download and activate new audio features.
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High End 2023 Munich Audio Show to Break Past Records
by audioXpress Staff

High End 2023 Munich Audio Show to Break Past Records

The Munich High End audio show plays an essential role as one the most important marketplaces for the audio industry. The 40th edition of the show, May 18-21, promises to break all records. Following the registration deadline for exhibitors, the High End Society reported increasing demand for the international audio show. The 2023 edition will see the second edition of the IPS – International Parts + Supply B2B section now taking place on all four days of the High End show, and supported by the ALTI Association.
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TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs
by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.
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Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs
by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.
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