SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

To be unveiled at CES 2025 is a new example of a MEMS microspeaker company that now offers an integration with a MEMS microphone. SonicEdge, the startup that pioneered ultrasound MEMS drivers and has yet to enter the market, will present SonicTwin, an integrated speaker-microphone in a single package. Combining the company's patented modulated ultrasound technology that eliminates traditional mechanical vibrations, makes the integration with a microphone and sensors much easier with potential benefits also for ANC and lower-power in TWS earbuds and headphones.

The new Cypress MEMS speaker from xMEMS Labs achieves 40X louder bass response on a single monolithic, miniaturized device, achieving well above the 130dB SPL at low frequencies, required for ANC implementations on TWS earbuds. The new xMEMS Cypress achieves this groundbreaking performance by using ultrasound technology. The new development will be demonstrated at CES 2024 by appointment only, with mass production scheduled for late-2024.

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.