Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology. An interview with John Turner, Senior Director, Product Management Voice and Music at Qualcomm Technologies International about the new Qualcomm S7 Pro platform that brings micro-power Wi-Fi and Bluetooth LE Audio to TWS earbuds. The same battery life, much better quality, high-res lossless audio, longer range, same user experience as Bluetooth on TWS earbuds. How does it work?

During its Snapdragon Summit event Qualcomm unveiled the latest S7 and S7 Pro Gen1 Sound platforms, which will soon power a new generation of advanced audio products. The new platforms offer five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to the previous generation. A real differentiator is the use of micro-power Wi-Fi to extend wireless audio range and support for up to 192kHz lossless music quality in the S7 Pro.

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

At Mobile World Congress 2022 in Barcelona, Qualcomm announced new options for brands and developers to offer the latest technologies in wireless audio. Qualcomm announced the latest S5 and S3 Sound Platforms with support for new Snapdragon Sound experiences, featuring lossless CD-quality streaming over Bluetooth, stereo recording, ultra-low latency sound with in-game chat, and adaptive active noise cancellation. Both new platforms already offer support for Bluetooth LE Audio.