Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Context-aware devices, such as the embedded smartphone keyboards, have been around for some time, though in a very limited form. By learning regularly used names, locations and phrases, they seem to know your next move, that is, predictive text. Similarly, but at a higher level, the next generation of smart audio devices will combine user-specific data, such as location, preferences and other device sensor data, including audio, to better serve the user.

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

We probably listen to more music and podcasts in our cars than anywhere else. Which means this is where we’re pushing the boundaries of audio experience — less noise, personalized sound zones, and control. And we’re more aware of the safety implications, not distracting or tiring the driver. This article was published in audioXpress, June 2020.