Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

Femtosense, in partnership with ABOV Semiconductor in South Korea, has launched the AI-ADAM-100, an artificial intelligence microcontroller unit (AI MCU) built on sparse AI technology to enable on-device AI features such as voice-based control in home appliances and other products. According to the Silicon Valley startup, the new AI-ADAM-100 AI MCU is a low-power, low-cost option for on-device language processing and voice-cleanup capabilities.

Microchip's Silicon Storage Technology (SST) subsidiary announced that its SuperFlash memBrain neuromorphic memory solution has helped WITINMEM solve speech processing challenges at the edge. The company's new neural processing, computing-in-memory SoC is the first in volume production that enables sub-mA systems to reduce speech noise and recognize hundreds of command words, in real time and immediately after power-up.

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.