Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge

At CES 2020, Syntiant announced a partnership with Sensory, combining the expertise and technologies in AI and speech recognition at the Edge, to deliver a deep learning, multi-lingual voice interface for battery-powered devices. The combined solution merges Sensory’s larger, higher-performance TrulyHandsfree wake word engine and voice control with Syntiant’s microwatt-power Neural Decision Processors (NDPs), bringing low-latency, real-time inference to edge devices.

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

QuickLogic, the developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its EOS S3AI platform for endpoint Artificial Intelligence (AI) and Machine Learning (ML) applications. The new AI platform provides all the hardware blocks needed to enable low power AI at the connected device endpoint. It comes with time-series (continuous) sensors, including accelerometer / gyroscope / magnetometer motion sensors and two digital microphones (PDMs).

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.