All items tagged with Tensilica HiFi DSP (22)

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Knowles Launches Raspberry Pi Development Kit to Enable Voice Integration for New Applications and Industries

September 23, 2021 by audioXpress Staff

Knowles Launches Raspberry Pi Development Kit to Enable Voice Integration for New Applications and Industries

Knowles announced the availability of the Knowles AISonic IA8201 Raspberry Pi Development Kit to bring voice, audio edge processing, and machine learning (ML) listening capabilities to devices and systems in a range of new industries. The new development kit bundles all of the hardware, add-on open software and algorithms required to test, prototype, and debug voice and audio functionality and integration in new applications for smart home, consumer technology, industrial, and beyond.

May 17, 2021 by audioXpress Staff

Cadence Offers MPEG-H 3D Audio Baseline Profile Decoders for Tensilica HiFi DSPs

Fraunhofer confirmed that Cadence Design Systems is now offering decoder implementations supporting the new MPEG-H 3D Audio Baseline Profile and has joined the MPEG-H Audio System trademark program administered by Fraunhofer. Adding MPEG-H 3D Audio Baseline Profile decoding capabilities to Cadence’s industry-leading Tensilica HiFi DSP designs opens up the potential to bring interactive and immersive sound to millions of users worldwide.

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

March 31, 2021 by audioXpress Staff

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

Elliptic Labs, the Norwegian software sensor technology company, announced a collaboration with Cadence Design Systems to optimize its machine learning algorithms on Cadence Tensilica HiFi DSPs. Enabling Elliptic Labs to expand its software sensor user interfaces to more embedded systems, while simultaneously reducing power consumption for energy-critical applications, this collaboration benefits manufacturers in a wide range of markets, including mobile consumer devices, and automotive.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

Klippel and Nuvoton Unveil Smart Amplifier Solution with Integrated KCS Speaker Control Algorithm

August 21, 2020 by audioXpress Staff

Klippel and Nuvoton Unveil Smart Amplifier Solution with Integrated KCS Speaker Control Algorithm

Klippel announced an exciting cooperation with Nuvoton Technology, a leading provider of consumer-electronics and computer ICs from Taiwan, to release a new type of smart amplifier with integrated Klippel Controlled Sound (KCS) technology that compensates for nonlinear speaker responses. As a result of the project, Nuvoton developed the highly efficient mono Class D audio amplifier devices, NAU83G10 and NAU83G20. Both devices are now available.

NXP Announces Far-Field Offline Voice Control Solution In Collaboration with Sonos

February 26, 2020 by audioXpress Staff

NXP Announces Far-Field Offline Voice Control Solution In Collaboration with Sonos

NXP Semiconductors announced availability of its voice solution, SLN-LOCAL-IOT, a fully integrated development platform for offline voice control. The solution consists of a full hardware module design and associated software required to implement far-field voice control with a customizable wake word and local commands. NXP also announced market availability of the i.MX RT600 crossover microcontroller (MCU) family, ideal for ultra-low power audio and voice applications.

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.

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