All items tagged with semiconductor (55)

AKM Semiconductor Audio DAC and ADC Production Disrupted by Fire

November 4, 2020 by audioXpress Staff

AKM Semiconductor Audio DAC and ADC Production Disrupted by Fire

After a major fire destroyed the Asahi Kasei Microdevices (AKM) semiconductor factory in Nobeoka, Miyazaki Prefecture, Japan, the company still has to provide a report on the disruption that this major disaster will cause to its business, particularly affecting the supply of critical DAC and ADC chips that are used by many high-end audio and studio equipment manufacturers. Non-confirmed reports state the company is already preparing to outsource production of the analog/digital LSI circuits exclusively produced at this facility.

GaN Systems Publishes Whitepaper Detailing Advantages of GaN Technology in Class-D Audio

September 15, 2020 by audioXpress Staff

GaN Systems Publishes Whitepaper Detailing Advantages of GaN Technology in Class-D Audio

GaN Systems published a document titled "GaN in Class-D Audio:Advantages with GaN Systems – a Comparative Look,” that reviews the various GaN and silicon transistor approaches in Class-D audio amplifier design techniques. The document identifies and compares the most popular GaN-based transistor and Silicon MOSFET solutions for high-performance Class-D amplifier applications, including the GaN Systems Class-D Amplifier and Companion SMPS Evaluation Kit.

Panasonic Completes Transfer of Its Semiconductor Business to Nuvoton

September 4, 2020 by audioXpress Staff

Panasonic Completes Transfer of Its Semiconductor Business to Nuvoton

Panasonic Corporation, based in Osaka, Japan, recently confirmed that it has completed the previously announced transfer of its semiconductor business to Nuvoton Technology Corporation, a Taiwan-based semiconductor company under the umbrella of Winbond Electronics Corporation group, following the receipt of regulatory approvals.

Analog Devices Confirms Maxim Integrated Acquisition

July 13, 2020 by audioXpress Staff

Analog Devices Confirms Maxim Integrated Acquisition

Analog Devices (ADI) and Maxim Integrated Products announced that they have entered into a definitive agreement under which ADI will acquire Maxim in an all stock transaction that values the combined enterprise at over $68 billion. The combination of the two North-American semiconductor companies was announced to increase scale and diversification of the combined business, enhancing domain expertise and breadth of engineering capabilities to develop more complete solutions. The transaction is expected to close in the summer of 2021.

Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds

March 25, 2020 by audioXpress Staff

Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds

Showing its importance to the CE industry as one of the world's largest advanced semiconductor manufacturers, Samsung Electronics announced the first all-in-one power management integrated circuits (PMIC), MUA01 and MUB01, optimized for True Wireless Stereo (TWS) devices. The new Samsung PMICs integrate multiple discrete components in one chip to make room for longer battery life and more efficient designs in today’s true wireless earbuds and other very low power designs.

Axign Completes Investment Round to Enter Production and Boost Audio Amplifier Technology

February 27, 2020 by audioXpress Staff

Axign Completes Investment Round to Enter Production and Boost Audio Amplifier Technology

Axign B.V. received an equity investment from KBC Focus Fund as the lead investor, together with Innovation Industries and Oost NL. This investment round enables Axign to mass produce and launch the company’s unique range of audio devices worldwide. Additionally, the new funding will support the development and introduction of next-generation devices for active speakers and streaming audio systems.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

OMRON Releases World's First MOS FET Relay Module with Solid State Relay in T-type Circuit Structure

December 9, 2019 by audioXpress Staff

OMRON Releases World's First MOS FET Relay Module with Solid State Relay in T-type Circuit Structure

OMRON Corporation of Kyoto, Japan released its new MOS FET relay module G3VM-21MT, the first electronic component in the world to adopt a "T-type" circuit structure, consisting of compact-size and longer-lifecycle solid state relays that output signals using no physical contact, therefore minimizing the leakage current that has long been a problem with semiconductor test equipment. The new G3VM-21MT relay contributes to reducing maintenance frequency of test equipment, allows high-precision measurements, and improves productivity of electronic components.

Cadence Announces Strategic Alliance Agreement with National Instruments to Improve Electronic System Development

December 3, 2019 by audioXpress Staff

Cadence Announces Strategic Alliance Agreement with National Instruments to Improve Electronic System Development

National Instruments and Cadence Design Systems, announced a system innovation strategic alliance to create an integrated design to test flow, leveraging reusable data and test IP from electronics design and verification to validation and production test for electronic system and semiconductor companies. Through the strategic alliance agreement, NI and Cadence expect the joint development of technology, methodology and intellectual property to streamline electronics development.

October 16, 2019 by audioXpress Staff

Vesper Hires Lorenzo Ponzanelli as SVP of Worldwide Sales and Business Development

Vesper, the piezoelectric MEMS specialist, announced that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive rapid global growth. The appointment is confirmed at a time when the Boston firm is expanding both engineering and sales teams and plans to expand in Europe and Asia, adding to its current offices in China, Korea and Singapore.

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