Qualcomm to Bring RISC-V Based Wearable Platform to Google's Wear OS

Qualcomm and Google are extending their collaboration on wearables by developing a RISC-V Snapdragon Wear platform that will power next-generation Wear OS solutions. According to the announcement, this is an important first milestone to bring RISC-V compatible CPUs to the Android ecosystem, while Google pursues is strategy of continuously copy everything that Apple does, and help others do the same.

Sonical, the Silicon Valley company developing an open software platform for hearables, announced a partnership with Dolphin Design, a leading edge computing and embedded AI silicon IP company, and a subsidiary of Soitec, an industry leader in designing and manufacturing innovative semiconductor materials. Together, the two companies are working on a heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will change the end-user experience with hearables.

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.