All items tagged with Nordic Semiconductor (34)

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

August 13, 2019 by audioXpress Staff

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

High performance analog semiconductor and wireless networking manufacturer Skyworks Solutions announced that its advanced connectivity engines are being leveraged by Nordic Semiconductor for ultra-low power wireless communications. Specifically, Nordic is utilizing Skyworks’ family of fully-integrated front-end solutions in conjunction with their multi-protocol system-on-chip (SoC) for Bluetooth Low Energy (LE) and emerging Bluetooth 5 applications.

Sogou Portable Smart Recorder C1 Leverages Nordic’s nRF52810 Bluetooth 5 SoC

August 7, 2019 by audioXpress Staff

Sogou Portable Smart Recorder C1 Leverages Nordic’s nRF52810 Bluetooth 5 SoC

Sogou, a Beijing, China-based technology company, has selected Nordic Semiconductor’s nRF52810 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the wireless connectivity for its Smart Recorder C1. Unveiled in Marc 2019 and now available, this Bluetooth LE portable voice recorder employs Nordic’s nRF52810 SoC to wirelessly transfer voice recordings to a smartphone app for transcription. According to Sogou, the device is able to achieve up to 95 percent speech-to-text accuracy in Chinese language.

u-blox Acquires Rigado’s Bluetooth Modules Business

August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

November 6, 2018 by audioXpress Staff

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

The "Bluetooth 5: System-on-Chip Comparison 2018 Complete Teardown Report" report has just been added to ResearchAndMarkets.com's offering. The report presents a technological and economical comparison of four of the newest and most competitive systems-on-chips (SoCs) available on the market today from four different manufacturers. They are: the QN9080 from NXP; the QCC5121 from Qualcomm; the DA14585 from Dialog Semiconductor; and the nRF52810 from Nordic Semiconductor.

Rigado Edge Connectivity Tool Suite Supports Bluetooth 5

November 29, 2017 by audioXpress Staff

Rigado Edge Connectivity Tool Suite Supports Bluetooth 5

Rigado has announced its Edge Connectivity Suite with full support for Bluetooth 5. Designed for large-scale commercial connected deployments, Rigado’s Edge Connectivity solution is comprised of Bluetooth 5 end-device modules and the Vesta IoT Gateway, which includes cloud-based tools for secure deployment and updating. The solution is based on Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC).

u‑blox Launches NINA-B3 Full-featured Bluetooth 5 Modules

October 4, 2017 by audioXpress Staff

u‑blox Launches NINA-B3 Full-featured Bluetooth 5 Modules

Swiss company, u‑blox, specializing in wireless and positioning modules and chips, announced the launch of its full Bluetooth 5 compliant NINA-B3 wireless MCU (microcontroller unit) module. Featuring Bluetooth low energy long range connectivity, high data transfer rates and supporting Bluetooth mesh and 802.15.4, NINA‑B3 caters to applications in smart buildings, smart cities, and the Industry 4.0, including home automation systems, sensor networks, and high-quality wireless audio applications.

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