STMicroelectronics Announces Industry-First High Performance 6-Axis IMU with Dual MEMS Accelerometer and Embedded AI

STMicroelectronics has revealed an inertial measurement unit (IMU) that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving package. The new LSM6DSV320X device is an industry-first IMU with dual MEMS accelerometer and embedded AI that is able to combine activity tracking and high-impact sensing in a miniature sensor for personal electronics.

It was a big product announcement from Analog Devices at Sensors Converge 2024, but aside for what was revealed to those attending the event, there has yet to be a formal announcement. The ADXL380 and ADXL382 are low noise, low power, wide bandwidth, 16-bit sensors that cover a dynamic range of 85dB, making them good options for precision applications with minimal calibration, with the ADXL380 being ideal for new true wireless ANC earbuds. audioXpress explores here all the important details about these two new 3-axis MEMS accelerometers.

The result of an intense research effort to achieve the most effective approach for an open ear design, Bose just introduced the all-new Ultra Open Earbuds, a completely new form-factor. Described as "a breakthrough audio wearable" the Bose Ultra Open Earbuds are designed to let users hear the world while still enjoying music. The approach is to use air conduction to feed audio to the inside of the ear, while resting on the lower ear. OpenAudio delivers the air conduction, while signal processing adds Bose Immersive Audio to enhance the experience.

TDK Corporation announced the availability of its InvenSense VibeSense360 TWS solution suite, previewed at CES 2023. VibeSense360 is a comprehensive portfolio of TDK hardware and software solutions designed to help solve some of the most complicated problems OEMs face when designing true wireless stereo (TWS) products with state-of-the-art features. On the hardware VibeSense360 includes the TWS-M601 6-axis IMU, and the TWS-M602 device, combining IMU, accelerometer and machine learning on-chip.

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.