TDK Launches VibeSense360 Next-Generation TWS Motion Sensor Solution

During CES 2025, TDK announced an enhanced next-generation InvenSense VibeSense360 motion sensor solution that will enable state-of-the-art spatial audio head tracking in new true wireless earbuds. The new VibeSense360 TWS solution includes motion sensor software, running on the latest SmartMotion ICM-45606 inertial measurement unit (IMU) that enables concurrent features of spatial audio, keyword assist, transparency for talk, head/UI gestures, and machine learning. The 220µA @50Hz 6-Axis IMU delivers industry-leading performance and battery life for TWS applications.

AAC Technologies showcased new audio and haptic solutions at CES 2025. Recognized as a leading source in sensors, actuators, and microspeakers, the company showcased solutions in many of these areas that are relevant for consumer product developments. Most notably, AAC Technologies introduced a range of self-developed haptic seat and premium sound products and solutions that once again set new industry standards.

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.