Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

Ceva announced the first complete multi-protocol wireless connectivity platform that supports Bluetooth High Data Throughput (HDT). This next generation technology meets the pressing need for Bluetooth devices looking to support streaming of even larger media at higher data rates. The new Ceva-Waves Links200 IP platform is designed to dramatically enhance wireless audio capabilities and support advanced applications like 7.1 audio systems.

SPARK Microsystems, the Canadian company specializing in next-generation ultra-wideband (UWB) wireless communications, will attend CES 2025 to showcase the latest breakthrough advancements in wireless connectivity for speakers and headphones. Visitors to SPARK's Palazzo Las Vegas suite can preview the myriad ways SPARK UWB technology is evolving wireless audio, gaming, and other connected devices, including for medical applications.

Underscoring the potential of solid-state MEMS microspeakers over-the-ear headphones, xMEMS Labs and Merry Electronics announced they will demonstrate a new production-ready reference design at CES 2025. Targeting both premium wireless over-the-ear headphones and gaming applications, Merry highlights xMEMS’ patented 2-way module architecture as a way to improve spatial audio accuracy and reduce weight for gamers, among other benefits.