All items tagged with development platform (101)

June 12, 2023 by audioXpress Staff

WiSA Technologies Begins Taking Pre-Orders for WiSA E Multichannel Audio Development Kits

Following previous announcements and demonstrations, WiSA Technologies is now taking pre-orders for its WiSA E development kits and production-ready modules. Using the 5GHz portion of the Wi-Fi band, WiSA E offers high-performance, high-quality wireless audio transmission and reception at an affordable price. WiSA E supports multichannel audio configurations transmitting uncompressed 24-bit/48kHz audio with a fixed latency of 20 milliseconds and tight channel synchronization.

Sensory VoiceHub 2.0 Integrates Generative AI for Fast Development of Custom Voice UIs

June 1, 2023 by audioXpress Staff

Sensory VoiceHub 2.0 Integrates Generative AI for Fast Development of Custom Voice UIs

Sensory announced the launch of VoiceHub 2.0, a new and improved version of the company's web portal for the development of wake words and custom voice recognition user interfaces. The updated solution now integrates generative AI-powered tools, making it an even more powerful, allowing developers to quickly create custom voice UIs capable of understanding spoken commands and natural language.

OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members

March 9, 2023 by Joao Martins

OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members

The ISE 2023 show in Barcelona saw the OCA Alliance bring forward several new developments and announcements that will continue to push the horizons of the AES70 control standard. During the show, presentations, demonstrations, and new members to the trade association showcased current and future technologies and tools that will further broaden the Open Control Architecture (OCA) Ecosystem.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

December 12, 2022 by audioXpress Staff

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

CEVA announced that it will make its CEVA-BX1 and CEVA-BX2 Audio DSPs and audio front-end software stack available for commercial developers through the Intel Pathfinder for RISC-V ecosystem. A Strategic Member of RISC-V International, CEVA is making its audio DSPs and software stack accessible for prototyping and production design through the Intel FPGA based pre-silicon development platform.

The MIDI Association Announces MIDI 2.0 Development Tools

August 16, 2022 by audioXpress Staff

The MIDI Association Announces MIDI 2.0 Development Tools

The MIDI Association has released details of the ongoing, industry-wide initiative by over 50 MIDI Association companies to develop MIDI 2.0 products and services. Despite the challenges presented by the pandemic, MIDI Association members persevered, and have addressed these challenges through global collaboration and cooperation. Following the demonstrations promoted by the MIDI Association at NAMM 2022, work on the latest USB MIDI 2.0 digital interface prototyping and testing tools continues.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

The MIDI Association Announces MIDI 2.0 Over A2B

June 2, 2022 by Joao Martins

The MIDI Association Announces MIDI 2.0 Over A2B

The MIDI Association announced the addition of MIDI 2.0 capabilities to the Automotive Audio Bus (A2B) technology from Analog Devices, Inc. The technology will be showcased at the MIDI Association during the NAMM show in Anaheim, California on June 3-5, 2022, with a demonstration of a USB to A2B bridge, based on AmeNote's ProtoZOA prototyping board for MIDI 2.0. using open source firmware for developers to use in their own hardware and software products.

HEM Unveils Serce Digital Audio System on a Module

May 30, 2022 by Joao Martins

HEM Unveils Serce Digital Audio System on a Module

Following the launch of three Ferrum products, HEM now announces Serce, a completely new digital audio platform that contains everything needed for a wide range of new hi-fi product developments. HEM is the audio manufacturing company from Poland that recently launched its own brand, Ferrum, with products aimed at high end audio enthusiasts. With Serce, HEM reinforces its position as a one-stop-shop solution for ODM/OEM audio electronics.

Automotive Audio Workflows Webinar with DSP Concepts and Tymphany, May 25

May 19, 2022 by Audio Engineering_Society

Automotive Audio Workflows Webinar with DSP Concepts and Tymphany, May 25

In the run-up to the AES 2022 International Conference on Automotive Audio taking place in Dearborn, Michigan [https://audioproducteducationinstitute.org/aes-2022-international-automotive-audio-conference/] the AES Audio Product Education Institute (APEI) is promoting a special webinar event focused on the future of automotive audio workflows. In this session, Roger Shively will lead a discussion with John Whitecar (DSP Concepts), Evan Bunner, and Matt Marchese (Tymphany) on the evolution of automotive audio systems, technology, and implementations.

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