All items tagged with CEVA (88)

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

March 2, 2023 by Joao Martins

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

On the opening day of Mobile World Congress (MWC) 2023 in Barcelona, OPPO announced a selection of flagship devices, new core connectivity products and technologies, as well as its latest R&D breakthroughs in chip technology. On the audio domain, OPPO promised to revolutionize the industry and leave Bluetooth limitations behind with its MariSilicon Y flagship audio SoC. A world first for Bluetooth wireless audio, the new SoC promises a 12Mbps data rate.

Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona

March 2, 2023 by Joao Martins

Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona

In 2022, the Bluetooth Special Interest Group (SIG) announced the Auracast extension of the Bluetooth LE Audio specifications, combining audio sharing and broadcast audio into a new term that would make it easier to promote. The audio innovation promises to propel audio streaming forward by letting users share their audio or select from publicly available Auracast wireless audio streams. At Mobile World Congress (MWC) 2023 in Barcelona the technology was demonstrated in a practical manner for the very first time.

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

February 16, 2023 by Joao Martins

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

What happened at CES 2023 related to wireless audio and Bluetooth LE Audio. And what might happen at MWC 2023. And why there's lots more happening in assistance, hearables, and Headphones 3.0. This article discusses Bluetooth LE Audio and Android 13. Bluetooth 5.4 updates. Sennheiser's MobileConnect Assistive Listening app that actually works over Wi-Fi. Sonical, Antennaware, et all, Headphone 3.0. UWB, and high-quality wireless audio. Originally published in The Audio Voice 410, February 16 2023.

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

December 12, 2022 by audioXpress Staff

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

CEVA announced that it will make its CEVA-BX1 and CEVA-BX2 Audio DSPs and audio front-end software stack available for commercial developers through the Intel Pathfinder for RISC-V ecosystem. A Strategic Member of RISC-V International, CEVA is making its audio DSPs and software stack accessible for prototyping and production design through the Intel FPGA based pre-silicon development platform.

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

November 15, 2022 by audioXpress Staff

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA announced the availability of its WhisPro speech recognition and control software to support designs using the Texas Instruments (TI) SimpleLink Wi-Fi CC3235x wireless MCU family, bringing ultra-low power, robust voice user interface to connected devices. The WhisPro Software Development Kit (SDK) allows full project customization, including choice of wake words and voice commands, and runs entirely on-device, without the need for a network connection.

CEVA Appoints Technology Industry Veteran Amir Panush as CEO Effective January 2023

November 9, 2022 by audioXpress Staff

CEVA Appoints Technology Industry Veteran Amir Panush as CEO Effective January 2023

After 17 years as CEO of CEVA and more than 32 years with the company, Gideon Wertheizer is set to retire at the end of the year. The CEVA board of directors has unanimously appointed Amir Panush as CEO effective January 1st, 2023. Wertheizer will continue to serve as an active member of CEVA’s board of directors and will be employed in an advisory role in the near term to ensure a smooth leadership transition.

Voice Control for Low Power Microcontrollers

November 3, 2022 by Ido Gus

Voice Control for Low Power Microcontrollers

Ido Gus, Deep Learning Senior Team Leader at CEVA’s Sensor and Audio Business Unit, writes about voice control deployment on low power and resource constrained microcontroller-units (MCUs). The article discusses what to consider for the development of products using voice as a primary human interface, and how speech recognition models using AI technology can support a wide variety of use cases and languages, without compromising on power requirements.

Unmute the World With Auracast Broadcast Audio

August 18, 2022 by Franz Dugand

Unmute the World With Auracast Broadcast Audio

Following the publication of the full set of LE Audio specifications by the Bluetooth Special Interest Group (SIG), the industry is now putting together the building blocks that will enabling bringing products supporting the next generation of Bluetooth audio to market. This article explains what is needed and how to support Auracast broadcast audio, a new Bluetooth capability that enables an audio transmitter to broadcast to an unlimited number of nearby Bluetooth audio receivers.

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

August 9, 2022 by audioXpress Staff

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

CEVA, Inc., the wireless connectivity and smart sensing technologies licensing company, announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion units during the second quarter of 2022. This significant milestone has been achieved as CEVA approaches it’s 20-year anniversary of being a public company. While the first 10 billion CEVA-powered shipments spanned more than 15 years, the next 5 billion shipments took less than three and a half years.

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

June 27, 2022 by Joao Martins

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

Flex Logix Technologies and CEVA, have announced the world’s first successful silicon implementation using Flex Logix’s EFLX embedded FPGA (eFPGA) connected to a CEVA-X2 DSP instruction extension interface. Enabling flexible and changeable instruction sets to meet demanding and changing processing workloads, the ASIC, known as SOC2, was designed and taped out in a TSMC 16nm technology by Bar-Ilan University SoC Lab, as part of the HiPer Consortium, backed by the Israeli Innovation Authority (IIA).

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